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Universal Instruments Corp. (Binghamton, NY) and CyberOptics Corp. (Minneapolis, MN) have signed an agreement to integrate the new Embedded Process Verification (EPV) inspection technology from CyberOptics into Universal's electronic component placement systems.

Universal will offer the EPV sensor system as a feature on its recently released platform placement machines that incorporate its new placement head. Introduction of the sensor is currently planned for the second half of 2004.

Ian McEvoy, president of Universal, said, "To achieve the challenging quality goal of less than 10 defects per million for surface-mount circuit board assembly, you have to verify each component placement. The CyberOptics' EPV is the first sensing system to enable this within the placement machine."

Steven Case, CyberOptics' chairman and founder said, "Unlike traditional inspection systems that are positioned after the placement machine in an electronics assembly line, EPV puts the inspection process right at the point of action, inside the pick-and-place machine. Ultimately, defects detected by the EPV sensor may be corrected while the circuit board is still within the placement machine."

Universal Instruments is an electronics productivity specialist, providing circuit, semiconductor and back-end assembly technologies and equipment, integrated system solutions and process expertise to manufacturers in every sector of the electronics industry.

CyberOptics Corp., specializing in optical technology, designs and manufactures a growing range of yield and through-put enhancement tools for the surface-mount electronic assembly equipment and semiconductor fabrication equipment markets.

www.uic.com

www.cyberoptics.com

Copyright 2004, UP Media Group. All rights reserved.

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Tyco Electronics (Willow Grove, PA), a business segment of Tyco International Ltd., will highlight the Opus 3 Selective Soldering System at this year's upcoming APEX show in Anaheim, CA.

The system is a four-axis Cartesian robot designed for selectively soldering through-hole and odd-form components into surface-mount and mixed-technology printed circuit boards (PCB) from the bottom side without inverting the PCB. It is a completely tool-less system for almost any soldering application.

The system is suited for applications where the product is delivered in small lot quantities and high product mix. The machine also functions well in high speed manufacturing environments when configured with site-specific solder nozzles. The optional tilt axis provides the peel-back found on conventional wave solder systems to insure bridge-free terminations.

The soldering system features the patent pending FlexSite miniature Gaussian solder wave, allowing for a 1-mm keep-out and increased thermal capability. The system features an adjustable board holder, spray fluxer, solder module and vision assist video for set up and process monitoring.

The system is ideal for accessing sites instead of assembly cases or sites shadowed by obstructions. Additionally, topside surface-mount components do not have to be reflowed when soldering only a few joints. The system is configured for bottom-side processing and uses process-specific subroutines for varying thermal demands, such as flow volume, solder temperature, emersion depth, travel speed and dwell. Featuring intelligent spray fluxing, the selective soldering system is designed for pass-through conveyor or batch operation, and is easy to program with instant changeover.

www.tycoelectronics.com

Copyright 2004, UP Media Group. All rights reserved.

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Metcal (Menlo Park, CA), a division of OK International, has introduced a compact, portable two-arm fume extraction system that combines strong fan performance with efficient filtration and quiet operation. Metcal enlisted the fume extraction expertise of Impell, another OK International division, to develop the system.

Building on Metcal's existing single arm system, the new unit features the same motor as the single-armed model, but has a one-stage impeller design that provides more than double the total free-blowing airflow. A proprietary impeller was chosen to maximize performance while keeping size and weight to a minimum. The result is a unit that can be easily transported by one person without strain.

Maximum free-blowing airflow is rated at 250m3/h, with maximum suction force at 850Pa. The 850Pa rating provides capability to handle any clogging that occurs during normal filter life.

The system's pre-filter is the best in class for this type of portable fume extraction system, while the main filter offers HEPA efficiency of more than 99.5% and an activated carbon filter.

The filtration system features a significant amount of activated carbon and a large filter area, to provide a long filter life and protection against clogging. The activated carbon makes the unit efficient at filtering gases.

The filter system has been designed to allow the pre- and main filters to be changed individually. The filters can be changed by undoing a latch on the side of the unit.

In operation, the stand-alone unit does not require a separate compressor or external ducting; it only needs to be plugged into a power source to be ready for use. The unit is designed for a universal power supply ranging from 100 to 240 VAC and 50 or 60Hz.

The unit is compact enough to be located under, or next to, the workbench. It can be used with either two 2-in. (50-mm) diameter hoses and BVX arms, or one 2.5-in. (67-mm) hose and an Omniflex arm. The single arm offers a 50% higher airflow than one of the smaller arms, with airflows per arm rated at 75m3/h and 110m3/h respectively.

www.metcal.com

Copyright 2004, UP Media Group. All rights reserved.

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New Venture Research (NVR), a U.S. market research and business development firm in the electronics industry, announced a joint venture with E. J. McKay & Co. (Shanghai, China), a corporate strategy and mergers and acquisitions advisory group, to assist original equipment manufacturers (OEMs) and contract manufacturers (CMs) in developing China solutions.

Given the strong interest in outsourcing manufacturing production to China today, the two firms are bringing together their skills and resources to assist electronics companies in identifying Chinese partners, acquisition targets and facilitating joint ventures. NVR and E. J. McKay recently collaborated in writing a syndicated market research report, "Electronics Manufacturing in China" that is published by Electronic Trend Publications.

"Companies needing a low-cost manufacturing solution sometimes do not know where to begin," said Randall Sherman, chief executive officer of NVR. "While NVR is recognized for providing business intelligence in China and other regions, companies often need a skilled and local advisory firm in the country to assist the transaction, perform due diligence and guide them through the legal and cultural channels. E. J. McKay perfected our offering of capabilities for clients in the U.S. and Europe. We thought it best to formalize a program that clearly addressed a China solution for a broader audience."

James Li, Managing Director of E. J. McKay, said, "While our company is a leading strategy and M&A advisor in China and India, we wanted to achieve more visibility and reach in the U.S. market for companies wishing to enter the China."

NVR and E.J. McKay indicate that the China Solutions program provides services in search, qualification, due diligence and transaction execution of mergers and acquisitions, joint ventures, Greenfield and other forms of vehicles. In particular, the program assists electronics companies through three critical stages: providing critical strategic business intelligence; assistance in identifying/choosing suitable Chinese business partners; and advising and facilitating the execution of M&A transaction.

www.newventureresearch.com.

www.ejmckay.com

www.electronictrendpubs.com

Copyright 2004, UP Media Group. All rights reserved.

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Indium Corp. (Utica, NY) has introduced PK-001 and PK-002 flip chip epoxy fluxes designed for use with Sn62 and Sn 63 eutectic solders. The fast curing, halide-free, no-clean fluxes can be used for flip chip or chip-scale package (CSP) soldering processes.

The fluxes have a stable thermoset residue, compatible with standard underfill materials, conformal coatings and most finishes and coatings. They are also environmentally friendly.

Many effective methods can be used to apply the fluxes, such as pin transfer, stencil printing, dispensing or dipping techniques.

Contact Indium Corp. to obtain a copy of the product data sheets.

Indium Corporation is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.

www.indium.com

Copyright 2004, UP Media Group. All rights reserved.

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Plexus Corp. (Neenah, WI), a provider of electronic manufacturing services (EMS), has secured an exclusive contract with Patientline PLC to manufacture, supply and install the Patientline bedside multimedia and entertainment system.

The contract gives Plexus sole manufacturing rights over a two-year period and covers the whole of the UK. According to the agreement, Plexus will provide complete product engineering, testing, volume manufacturing and installation services for the bedside units.

The contract also includes Plexus managing the complete supply chain for Patientline from component sourcing to warehousing, logistics, installation and repairs.

The bedside unit has now been installed in over 100 hospitals throughout the UK. It brings TV, telephone, radio, email, Internet and entertainment access direct to the patients' bedside.

www.patientline.co.uk

www.plexus.com

Copyright 2004, UP Media Group. All rights reserved.

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