BERG, SWITZERLAND – Alphasem AG has sold its 250th Swissline die attach machine in North America, the company said today.
The second-generation machine for die attach and sort processes was introduced in 2001.
Alphasem is a supplier of packaging equipment to Intel, Infineon, Micron, IBM, Amkor and Texas Instruments.
HERNDON, VA — The International Electronics Manufacturing Initiative consortium next month will sponsor a "state of the industry" forum on RFID technology.
The meeting is scheduled for Oct. 4, at Sun Microsystems in Newark, CA.
Read more ...
STUTENSEE-BLANKENLOCH, GERMANY – Test solutions provider Digitaltest has added a local distributor on South America. Macon SRL will provide sales and service representation for Digitaltest's range of in-circuit, flying probe and functional test equipment.
In a statement, Digitaltest's Hans Baka said, "Many of our global customers now require support on their doorsteps – a trend that has seen Digitaltest expand its presence in several key geographies over the last few years.”
BINGHAMTON, NY – Endicott Interconnect Technologies has selected the AdVantis and Polaris platforms from Universal Instruments Corp. for military product applications, Universal said today.
The companies said the platforms were selected in order to automate production of a chip carrier for a leading military supplier. The product features several hundred surface-mount components, several memory devices and a very large heat spreader, the companies said.
AdVantis is a flip chip placement system; Polaris handles multiple assembly processes, including dispensing and underfill.
EI is a spinoff from IBM and builds chip packages, printed circuit boards and electronics assemblies.