The next advance in medical electronics is treatment that electronically links patient to specialist, a move that can sharply cut costs.
Active programs are evaluating the use of nano-sized tin, silver and copper particles in Pb-free solders that can be processed below 200°C.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing