Intermetallic growth and micro-voiding are issues for boards used in high-temp applications.
The pending J-STD-020D has updated guidelines for handling Pb-free parts, and no more “Tp.”
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing