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Saki's 3Si/3Di-EX Series of 3-D SPI and AOI systems introduce a modular hardware design that allows seamless optical unit upgrades.

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Nordson Electronics Solutions' Asymtek Select Coat SL-1040 ultrasonic cleaning station is designed to keep nozzles and needles clean and prevent clogging in conformal coating systems.

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ECD’s M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler.

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Hirose's DF53 Series connector is its newest addition to its SignalBee connector platform.

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MacDermid Alpha Electronics Solutions Alpha HiTech CF31-4026 reworkable edgebond is for high-reliability applications in automotive electronics and high-performance computing.

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SpiCAT SpiSCAP online engineering simulation software is for evaluating and selecting SCC and SCM Series supercapacitors for power challenges in industrial, energy, automotive, transportation, telecommunications, commercial building, and consumer electronics applications.

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