AlphaPREP PC-7030 oxide replacement system produces a highly bondable brown conversion coating on copper innerlayers using horizontal equipment by removing minimal amounts of copper.
 
Specially formulated for low-etch/high capacity operations, offers up to 60% reduction in consumption and waste treatment. Featuring a low copper etch factor of 0.9 - 1.1u, copper loss from fine lines and thin copper is reduced, improving performance on controlled impedance. 
 
Other benefits include:
Reduction in consumption and waste treatment;
Increased peel strengths on High Tg dielectrics;
Less frequent bath changes with increased up-time;
Improved yields and reliability.
 
 
Enthone Inc., www.cooksonelectronics.com

New control and hardware capabilities are available for the Power Column 2 vertical lift module (VLM).
 
Hardware capabilities include an increase in vertical travel speed from 29 in./sec. to 55 in./sec.; specialty trays in widths up to 157" (98" standard) and weight capacities up to 1100 lbs (880 lbs standard).
 
An integrated parts lookup table enables the operator to search for a part number and then have the module automatically retrieve the tray where the part is stored.
 
Other control modifications include new screen designs on the unit's touch-screen keypad. Additional software control choices are also available.
 
Rack-and-pinion drive allows pinpoint retrieval of item trays without adjustment. Available in heights from 10 to 50', features options such as a tilt-tray up to 45°, a lift system that adjusts the height of the pick tray and a lockable powered door.
 
FKI Logistex, www.fkilogistex.com

Soder-Wick Lead-Free Desoldering Braid is engineered for high-temperature, lead-free solder removal. Maximizes heat transfer to the solder joint, melting the solder faster and more efficiently than conventional desoldering braids. Designed and optimized for all lead-free solders, said ton prolong the tip life on soldering irons.

ITW Chemtronics, www.chemtronics.com

 

 

Release 4.2 of the graphical Boundary Scan operating system SYSTEM CASCON features more than 20 new technologies and tools. Besides the Navigator, Component Explorer and an improved programmer, the HYSCAN (Hybrid Scan Technology) addition aids the execution and diagnosis of hybrid formatted test patterns.
 
HYSCAN is  based on a new hardware-independent emulation method and relieves the user from the entire handling of serial-to-parallel vectors. Test program generation and fault diagnosis can be done without  knowing the type of test access. The parallel test vectors are connected with the individually configured pin electronic by means of Wrapper Modules. By exchanging these modules, the parallel vectors can be linked to the required pin electronic without re-compilating the test program. The first supported pin electronic are the parallel I/O modules PXI 5296 and PXI 52192 with 96 and 192 test channels, respectively.
 
The Component Explorer is a graphical tool for the interactive generation and manipulation of intelligent design data. Unknown components and complete component cluster can be defined and implemented into the database. Is directly linked with Scan Vision tools for the visualization of schematic and layout as well as the graphical library.    
 
The Navigator tool for the interactive user guidance gives support in terms of hyperlinks, videos or topic related documents.
 
The new version is downwards compatible to all previous versions and supports all Boundary Scan controllers on basis of VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232 and Fast Ethernet.

GÖPEL electronic, www.goepel.com