BP-3106 BGA Bumping Solder Paste produces large deposits of solder material in bumping and other applications using only an SMT printer with a bumping stencil.

Applied using existing equipment, increasing the BGA substrate panel size and printing speed without extra investment in equipment such as BGA ball placement hoppers.

Said to exhibit excellent release properties, robust slump resistance and ultra-low voiding. Can be used for both area array and peripheral BGAs and passes SIR before and after cleaning.

Standard packaging includes 500 g jars and 700 g Semco cartridges. Can be applied using an enclosed printhead such as DEK's ProFlow and MPM rheo pump.   

Indium Corp., www.indium.com

 

 

Multicore TTC-LF allows soldering irons to be re-tinned, even when conventional methods such as sponges, pads or rosin-cored solder wire are not effective.

 

Applicable for lead and lead-free applications, the product is a small block of electronics lead-free grade solder powder and flux formed into the shape of a thick disk. For cleaning and de-wetting soldering irons, users need only wipe the tip of the soldering iron gently across the surface to produce local melting and then wipe as normal on a damp sponge to ready the iron for re-use.

Benefits include minimal residues, activators that thermally decompose into inert components and the ability to clean heavily oxidized metal surfaces such as copper and iron plated soldering tips.

Henkel, www.electronics.henkel.com

 

Polyclad Laminates Inc., a business of Cookson Electronics, has introduced Polyclad 250HR laminate and prepreg materials. With a 150°C glass transition temperature (Tg) and 350°C decomposition temperature (Td), is suited for mid-Tg, lead-free applications. The CAF-resistant materials maintain low expansion rates while retaining FR-4 processability.
 
Used in the manufacture of automobiles, computer servers, telecommunications devices and other electronics, said to offer exceptional IST thermal performance and reliability. Contains a multifunctional epoxy resin technology for reduced CTE.
 
Compatible with all commonly used FR-4 fabrication process techniques. Mechanical, chemical and moisture resistance meet or exceed the performance of competitive FR-4 material. Is laser fluorescing and UV blocking for maximum compatibility with AOI systems, optical positioning systems and photoimageable solder mask imaging.
 
Polyclad Laminates, www.polyclad.com 

A major upgrade to the CR-5000 enterprise-wide PCB design suite of tools includes 44 productivity enhancements in schematic capture, layout and simulation.

Version 8.01 is aimed at designers of high-complexity boards that use extreme miniaturization technologies such as embedded passives, flex circuits, high-density interconnects and FPGAs. Capabilities include RF design, design re-use and design partitioning  with core design strengths that meet the requirements of consumer and high-tech electronics applications. Built on the design structure and methodology of version 7.

Enhancements to schematic capture and analysis module include a net connect view, the ability to import and export net label and pin information in CSV format, new fault analysis functions and a property viewer that can be used during symbol re-load. The upgrades to the Board Designer placement and routing module mean that users have use of automatic area correction functionality, benefit from even deeper integration with mechanical CAD and can achieve more consistent star-point connections. The board layout tool can space tracks automatically based on the electrical potential difference between them, and has support for multiple bond wires.

Zuken, www.zuken.com