The handheld, portable instrument measures impedance in compliance with ANSI 6.1 and ESDA S20.20 requirements.
Measures three important ground parameters:
1) Impedance Meter - Measures the true value in Ohms on ground regardless of ground currents and noise/EMI that is common on working tools, with alarm threshold settings.
2) High Frequency (EMI) Signal Meter - Measures the peak and average of the high frequency (EMI) signals traveling in the tool or facility ground. User defined alarm thresholds will audibly warn of high frequency (EMI) signals above preset levels.
3) AC Voltage Meter - Measures the AC voltage on ground, if ground is miswired accidentally, as with the other features, an audible alarm indication with notify the user.
Credence Technologies, credencetech.com
The Quick-Change Solder Pot allows for easy changeover between tin/lead and lead-free alloys. It is inserted in a cart on rollers, making it simple to move the pot to and from a storage location.
Cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders and are capable of withstanding temperatures of 315ºC (600ºF). All stainless steel components that come into contact with the solder are composed of ElectroCoat corrosion-resistive surface conversion as a standard feature, or titanium as an option.
UltraFill Lead-Free nozzles are 40% wider than traditional tin/lead nozzles to increase contact length and dwell time. Are also placed closer together to reduce the temperature drop between nozzles – so less heat is needed to reflow solder joints in the second wave. Reportedly deliver better hole fill without requiring a slowing of the conveyor, while reducing bridge defects and dross production.
Nitrogen shroud is available as an option – and allows for either air or nitrogen operation without the need to change nozzles. The shroud encompasses the nozzles in the pot and contains the dross in the solder pot. It lifts for easy maintenance and dedrossing – without nozzle removal.
Speedline Technologies, speedlinetech.com
With the release of BP Win 4.54, all newly manufactured device programmers will ship standard with USB 2.0 communication interface.
The new product line -- 1410/84, 1410/240,1610, 2610, 3610, 4610 -- replaces earlier programmer models that used a parallel port to communicate from the PC to the programmer.
New programmer models also reportedly feature an average increased programming speed of 20%.
USB 2.0 upgrade kits are also available for existing customers using 6th and 7th Generation manual programmers.
New device programmers are supported in Windows 2000 and XP.
BP Microsystems, www.bpmicro.com
New items include Variable Angle and Packing Bench Shelving, Switchable 2/4 Bulb Lamp Fixtures, Reversible Tack and White Boards, Modular Data Beams, Steel Parts Bin and Pegboard Panels.
All accessories are forward and backward compatible with systems already installed in the field and those shipping today.
Arlink, www.arlink.com
The ECA launched a digital library (available at ec-central.org) that contains more than 300 technical papers taken from proceedings of recent CARTS and ECTC conferences.
It enables visitors to search for individual conference papers by event name, title and keyword. Papers can be purchased as PDFs and downloaded for $10 (ECA members) or $20 (non-members). The library is soon expected to double in size and include papers from additional CARTS and ECTC events, the annual relay and switch forum (IRSTC), and the wire and cable symposium (IWCS).
The Electronic Components, Assemblies & Materials Association (ECA), ec-central.org
Both materials were tested before and after reflowing various PCBs. In all cases, print remained clear with no visible effects.
The polyimide label materials coated with a permanent pressure-sensitive acrylic adhesive and a high opacity, medium gloss white topcoat are designed for thermal transfer printing. Barcode labels made from the material reportedly demonstrate excellent performance in lead-free wave solder environments, which range from 260º to 290ºC.
Designed for barcode or alphanumeric identification of PCBs or related electronic components. Can withstand mixed circuit board processes on top or bottom side of the board. Said to have excellent resistance to harsh fluxes, cleaning agents, saponifiers and wave solder environments.
Polyonics, www.polyonics.com
Press Releases
- Stannol Welcomes James Wertin as Director of Technical Sales and Solutions – North America; Thomas Ruch Comments
- APE, Automated Production Equipment, Marks 56-year Milestone
- Kitron Signs Multi-Year Agreement for Advanced Sensor Manufacturing in Europe; Kristoffer Asklöv Comments
- Scanfil Boosts Investment in Electronics Manufacturing in the US; Christophe Sut Comments