Enhanced Concept 129 Intelli-Drill includes a companion Database and Search Utility. These tools inspect and measure internal layer movement, then assist in using this information to improve process yields.
 
Database is loaded by the CNC-7 Controller during panel inspection. Search Utility allows the user to search for data and perform statistical analysis. This data is then fed back to the beginning of the PCB design process to improve production process yields
 
Database can be searched from any networked PC.

Excellon Automation, excellon.com
Booth 2031
 

 

Excellon Automation, excellon.com
Booth 2031

Wave Surfer is a self-contained measurement system for wave solder machines that provides critical data on wave solder machine setup and its process.  As a wave solder machine profile fixture, it has five embedded thermocouples, and works in conjunction with the SlimKIC 2000 for quick and easy profiling and setup. 
 
Made of a material similar to typical wave solder pallets, can withstand thousands of passes. The fixture holds the SlimKIC in place during each run to measure process data including peak temperature, dwell time, parallelism and conveyor speed. 
 
Apex booth 363

FX-1R High-speed Chip Shooter is equipped with a double head system driven by two independent linear motors. Both quadruple heads have a multi-nozzle alignment system using a high-resolution laser. This technology simultaneously measures four different components in width, length and height. In-flight measurement eliminates idle time.

Placement rate is 27,000 cph  (IPC 9850), component range from 0201s to 11 x 26.5 mm to 20 x 20 mm. Placement accuracy is  ±40µm (3 Sigma).
 
Juki Automation Systems, jas-smt.com
Apex booth 1069

EnviroMark 907 (EM907)  is a no-clean, lead-free solder paste designed for high-yield lead-free manufacturing. Said to offer a long stencil life and Pb-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains print quality at high print speeds — up to 6 in/sec. (150 mm/sec.). Said to have excellent cold and hot slump behavior to prevent bridges and solder ball formation.
 
Reportedly has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features high levels of solderability to a wide array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, comparable to 63/37, even in air reflow. The paste leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites, has printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
 
Kester, kester.com
Booth 1085