FLX500 is a self-contained, automated device programmer that fits on a desktop. The system will be introduced at Nepcon UK and Semicon Singapore next week.
“Customers constantly share with us the costly problems they have with gang programmers – bent leads, blank devices, incorrectly programmed devices, high levels of scrap – but at the same time they often do not have the facilities, the operators, the time for training, or the physical space required for a sophisticated automated programming system,” said Megan Miller, director of marketing. “The FLX500 offers a solution that drastically reduces the errors and waste inherent in manual programming. The FLX500 is modular and expandable, it supports virtually all device packages, and it is ideally sized to fit almost anywhere.”
Enables ‘plug and program’ automated programming. Touch screen user interface is language independent, eliminating operator training and mistakes. Requires no special installation. Can be plugged into a standard wall outlet. Self-contained air supply eliminates the need for an external air system. Picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays.
Has FlashCORE precision programming technology, with high-speed programming for leading Flash and serial memory devices, NAND flash and programmable microcontrollers. Supports BGA, mBGA, CSP, PLCC, TSOP, QFP and others, with throughput over 500 devices/hr.
A flexible rental option allows EMS companies, for example, the flexibility needed to meet short-term or volatile contract requirements without a major capital investment.
Data I/O Corp., www.dataio.com
NEPCON, UK
Booth G37 (with Accelonix)
Semicon, Singapore
Booth 928 (with TransTechnology PTE Ltd.)
“Customers constantly share with us the costly problems they have with gang programmers – bent leads, blank devices, incorrectly programmed devices, high levels of scrap – but at the same time they often do not have the facilities, the operators, the time for training, or the physical space required for a sophisticated automated programming system,” said Megan Miller, director of marketing. “The FLX500 offers a solution that drastically reduces the errors and waste inherent in manual programming. The FLX500 is modular and expandable, it supports virtually all device packages, and it is ideally sized to fit almost anywhere.”
Enables ‘plug and program’ automated programming. Touch screen user interface is language independent, eliminating operator training and mistakes. Requires no special installation. Can be plugged into a standard wall outlet. Self-contained air supply eliminates the need for an external air system. Picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays.
Has FlashCORE precision programming technology, with high-speed programming for leading Flash and serial memory devices, NAND flash and programmable microcontrollers. Supports BGA, mBGA, CSP, PLCC, TSOP, QFP and others, with throughput over 500 devices/hr.
A flexible rental option allows EMS companies, for example, the flexibility needed to meet short-term or volatile contract requirements without a major capital investment.
Data I/O Corp., www.dataio.com
NEPCON, UK
Booth G37 (with Accelonix)
Semicon, Singapore
Booth 928 (with TransTechnology PTE Ltd.)
Alphasem has introduced a tape applicator module for the Swissline 9022 die bonder series. Offers process control and high productivity.
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
Alphasem AG, alphasem.com
GÖPEL electronic introduces the SFX-5704 as additional component to the JTAG/Boundary Scan hardware platform Scanflex. The I/O Module (SFX Module) was developed for the production test of mixed-signal applications and provides four parallel and independent channels.
Can be freely combined with controllers on PCI, PXI, USB, FireWire or LAN basis as well as TAP transceivers with distances up to five metres.
Each of the four channels features a fully-fledged driver/sensor pin electronic combined with an analog measuring function. For digital tests each channel can be switched to Input, Output, Bidir or Tri State (interposing relay). Individually programmable parameters such as input-voltage (±10V), output-voltage (±10V), maximum driver current up to 300mA and programmable Pull Up and Pull Down resistors enable an application oriented test channel adaptation to the signals to be tested.
Safety measures for the Unit Under Test include automated overcurrent recognition with subsequent current limit (fold back), dynamic driver current gain adaptation (backdriving) as well as a specific clip switching for freely programmable oppression of overshoots on the connected signal lines.
The analog measuring function has an input range of ±10V at a 12 bit resolution. Analog and digital functions can simultaneously be operated at active clip switching.
GÖPEL electronic, www.goepel.com
Can be freely combined with controllers on PCI, PXI, USB, FireWire or LAN basis as well as TAP transceivers with distances up to five metres.
Each of the four channels features a fully-fledged driver/sensor pin electronic combined with an analog measuring function. For digital tests each channel can be switched to Input, Output, Bidir or Tri State (interposing relay). Individually programmable parameters such as input-voltage (±10V), output-voltage (±10V), maximum driver current up to 300mA and programmable Pull Up and Pull Down resistors enable an application oriented test channel adaptation to the signals to be tested.
Safety measures for the Unit Under Test include automated overcurrent recognition with subsequent current limit (fold back), dynamic driver current gain adaptation (backdriving) as well as a specific clip switching for freely programmable oppression of overshoots on the connected signal lines.
The analog measuring function has an input range of ±10V at a 12 bit resolution. Analog and digital functions can simultaneously be operated at active clip switching.
GÖPEL electronic, www.goepel.com
B300 tabletop ultrasonic cleaner includes a stainless steel cleaning tank using industrial-style ultrasonic transducer technology, at 40KHz. Includes an automatic 15 min. timer and comes with a cover and perforated stainless steel basket.
Inside tank dimensions are 11.8 x 3.9 x 2.9”, with half-gallon capacity, in either a 115 or 230 volt unit.
Applications include difficult soils or contaminations, removing brazing fluxes, polishing compounds, lens cleaning. Ideal markets include jewelry, optical and veterinarian markets.
Branson Ultrasonics Corp., www.sonifier.com
Inside tank dimensions are 11.8 x 3.9 x 2.9”, with half-gallon capacity, in either a 115 or 230 volt unit.
Applications include difficult soils or contaminations, removing brazing fluxes, polishing compounds, lens cleaning. Ideal markets include jewelry, optical and veterinarian markets.
Branson Ultrasonics Corp., www.sonifier.com
AccuCheck ESD inspection template allows Photo Stencil to offer precision component verification inspection templates to its customers, directly from its headquarters in Colorado Springs, CO.
“Now that the equipment is located at Photo Stencil’s facility, the company can offer full design and fabrication capabilities, as well as the timely deliveries our customers have come to expect. This is yet another in-house service that Photo Stencil has the capability to offer,” said Mike Burgess, stencil product manager.
Plastic laser-cut templates are a cost-effective and timely alternative to automated optical inspection equipment. Can be used for all board types including SMT, Pin Through Hole Technology (PHT) and combinations of both. The standard turn time is 24 to 48 hrs, depending on the verification of data received.
Photo Stencil, www.photostencil.com
“Now that the equipment is located at Photo Stencil’s facility, the company can offer full design and fabrication capabilities, as well as the timely deliveries our customers have come to expect. This is yet another in-house service that Photo Stencil has the capability to offer,” said Mike Burgess, stencil product manager.
Plastic laser-cut templates are a cost-effective and timely alternative to automated optical inspection equipment. Can be used for all board types including SMT, Pin Through Hole Technology (PHT) and combinations of both. The standard turn time is 24 to 48 hrs, depending on the verification of data received.
Photo Stencil, www.photostencil.com
Multi-Seals offers an alternative to liquid epoxy for high-volume epoxy sealing applications. Uni-form epoxy preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants.
Features close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch. Preforms can be dispensed at 200 to 600 parts/min. with little or no operator training. Eliminate pot-life concerns and costly cleanup procedures. Available in a range of shapes, sizes and materials to accommodate diverse applications.
Multi-Seals Inc., multi-seals.com
Features close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch. Preforms can be dispensed at 200 to 600 parts/min. with little or no operator training. Eliminate pot-life concerns and costly cleanup procedures. Available in a range of shapes, sizes and materials to accommodate diverse applications.
Multi-Seals Inc., multi-seals.com
