Leica EZ4 StereoZoom can achieve sharp, clear images with light as bright as fiber optic illumination. Five integrated LEDs can be switched individually, dimmed and combined with transmitted light. Daylight 6500°K color temperature remains constant; true colors are preserved. Three-way incident light technology provides illumination to view samples from strongly structured objects to flat probes. LEDs have a 25,000-hour service life, which means no more bulbs to replace. The LEDs stay cool; microorganisms and plant samples are protected.
Other features include:
Image transfer is easy; PC connection is not required. Insert an SD card to record images, then upload to a PC via a card reader, projector or video recorder.
4.4:1 zoom ratio provides magnification range from 8-35X (with 10X eyepieces).
3 EZ4 versions are available: Integrated 10X/20 high eyepoint eyepieces; integrated 16X/15 high eyepoint eyepieces; and open eyetubes.
Eyetube angle of 60°.
100 mm working distance for easy access to specimens.
No removable parts.
100V to 240V integrated universal power supply.
The complete E-Series product line is designed to provide high-quality image, color and detail fidelity combined with mechanical precision for decades of maintenance-free functionality.
Leica Microsystems Inc., leica-microsystems.us
Other features include:
Image transfer is easy; PC connection is not required. Insert an SD card to record images, then upload to a PC via a card reader, projector or video recorder.
4.4:1 zoom ratio provides magnification range from 8-35X (with 10X eyepieces).
3 EZ4 versions are available: Integrated 10X/20 high eyepoint eyepieces; integrated 16X/15 high eyepoint eyepieces; and open eyetubes.
Eyetube angle of 60°.
100 mm working distance for easy access to specimens.
No removable parts.
100V to 240V integrated universal power supply.
The complete E-Series product line is designed to provide high-quality image, color and detail fidelity combined with mechanical precision for decades of maintenance-free functionality.
Leica Microsystems Inc., leica-microsystems.us
Promation is offering an enhanced option on all of its PCB handling equipment that tracks and displays the operational sequence of the station through its various functions. The option also includes automatic width adjustment, offset width adjusting, password protection and error tracking.
Additional features of the Signature Series include: manual mode operation (can operate independent features of the system with the press of a button), PCB counter (tracks the number of products passed) and Auto mode(for production run).
Promation, pro-mation-inc.com
The 15th version of GerbTool has a host of new features and technology, such as HyperNETLIST generation, that have been handed down from VisualCAM. It increases netlist generation performance over competitive tools by 5 to 10X.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
This release contains a series of enhancements to help users increase throughput.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
Universal Instruments will demonstrate its latest platform placement system, the AdVantis XS, at Semicon West. Designed for the convergence of semiconductor and standard surface-mount assembly, the system deploys Universal’s VRM linear motors for accuracy and repeatability.
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
Universal Instruments, uic.com
Semicon West Booth 7039
AdVantis XS evolved from the GSMxs, delivering similar accuracies of +/-9 microns at +/- 3 sigma, but with a 25% increase in feeder capacity for on-machine inventory and a 15% speed improvement. Advanced materials engineering and optimized design offers customers a price some 25% lower than its predecessor, with backward compatibility, shared resources and common interfaces.
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
Universal Instruments, uic.com
Semicon West Booth 7039
Practical Components Inc., a distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, has added Thin Array Plastic Package (TAPP) to its selection.
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers.
Practical Components Inc., practicalcomponents.com
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers.
Practical Components Inc., practicalcomponents.com
Syon electrically conductive adhesive solders can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. The epoxy and epoxide formulations mix and pour easily, fill voids and cure with minimal air entrapment. Reportedly provide environmental and impact resistance.
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F. Can be used in service temperatures from -65° to 200° F.
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from -65° to 200° F.
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from -65° to 200° F.
Devcon, devcon.com
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F. Can be used in service temperatures from -65° to 200° F.
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from -65° to 200° F.
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from -65° to 200° F.
Devcon, devcon.com
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