Circuits Assembly Online Magazine - Features

Araldite 7047 is a one-component, silver-filled epoxy adhesive said to combine high electrical and thermal conductivity. Is said to be a high purity, 100% solids system for void-free bonding of circuitry and ICs. Features a work life of up to four days at room temperature and reportedly cures in one hour at 165ºC (329ºF). Is compatible with Pb-free processing. Has aluminum/aluminum lap shear strength of 1300 psi and gold/gold die shear of 1700 psi at room temp. Volume resistivity at room temp. is <0.0002 ohm-cm. Has a Tg of 130ºC (266ºF) and CTE of 72 ppm/ºC.

Huntsman Advanced Materials, www.huntsman.com/electronics

The Siplace X- and D-Series platform are said to accurately place components down to 01005 with no interruption in speed. The X4 is said to provide the fastest placement output per sq. ft. at 90,000 cph from a single machine. Comes standard with advanced digital component vision. A D2/D1/D1 line has more than 225 feeder inputs and 28 trays. Component range is from 01005 to 8 x 85 mm.

Siemens, www.usa.siemens.com

The Evo 2200 die bonder’s dispensing and bonding systems work in a single module. Throughput is said to reach 5000 cph and a footprint of 116 x 122 cm. Said to process up to 25 different 300mm wafers in a single pass. Has 14 pickup tools and five ejection tools available. Includes heatable bonding tool and the handling range from 250 microns small up to 50 mm large dies.

Datacon, www.datacon.at

The Medalist SP50 Series 3 solder paste inspection system reportedly provides 100% automated 2-D and 3-D inspection for process characterization and defect prevention. 3-D scanning speed is said to be 38.7 cm2; fiducial inspection and load/unload less than five sec.; gauge repeatable and reproductibility capability less than 10% gage R & R. Reportedly accommodates board sizes 2 x 2" to 20 x 20".

Agilent, www.agilent.com

Goepel’s JTAG/Boundary Scan includes VarioCore. Reportedly allows the reconfiguration of Scanflex I/O modules with special intellectual property to support a range of test capabilities in the same hardware setup.

Goepel, www.goepel.com

The Opto-Bonder Femto handles various assembly technologies, including power laser/laser bar bonding, flip chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass and simple die attach. Said to combine accuracy (+/-0.5 micron) and flexibility in a small footprint (1270 x 900 mm). Reported features: a 25% larger table, motorized x, y, z and theta movements, maximum die size up to 4" diameter, and substrate size up to 6" diameter. Bonding processes automatically controlled.

Finetech, www.opto-bonder.com