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The Juki 350 selective soldering system comes standard with an X,Y, Z and A axis servo drive and is equipped with all the functionality necessary to begin production immediately. Includes a soldering unit that features forced hot air nitrogen preheat at the mini-wave nozzle. Nitrogen preheat limits dross buildup, opening the process window and reducing maintenance. An innovative nitrogen management system is used to reduce nitrogen consumption. Other standard features include a spray fluxer or micro-dot drop jet fluxer mounted on an individual A axis servo drive; 5-liter pressurized flux tank; an exchangeable quick exchange mini-wave nozzle from 4 to 30 mm in diameter (custom nozzles are available by request); exchangeable Pb-free ready solder pot with 110 lb. capacity; auto feeder solder roll for maintaining solder pot feed level; a wave height on/off control feature; online/offline programming software that can accept images such as JPG, BMP, TIF, as well as Gerber files for easy programming with a simple to use GUI; and a float sensor for keeping constant levels of solder in the pot at all times. Comes with dual nozzle and dual fluxing capability.

Juki Corp., www.jas-smt.com

PCS peelable coating mask is a flexible synthetic acrylic latex designed to withstand coating and wave soldering processes. Is water-based and environmentally friendly. On application the mask is orange and darkens once cured. Said to it peel easily after curing. Reportedly noncorrosive to most substrates, with good solvent resistance. For masking components, connectors and other items during a conformal coating process. Is suitable for dip, spray or brush applied conformal coatings.

Electrolube, www.electrolube.com
The BC-60 edge carry transfer conveyor is 600 mm in length and has a single drive; the BC-100 comes with a single 1M drive or 2-500 mm drives. The ESD edge belt is 3 mm wide and can handle PCBs up to 18" in width. Features include variable speed control, front ESD work surface with grounding strap (green or royal blue mats available), Inspect and Pass mode selection with both hand and foot pedal for PCB release, and programmable logic controller.

Promation Inc., www.Pro-mation-Inc.com

This no-drip, Pb-free, no-clean SAC 305 solder paste for mechanical soldering is said to be excellent for gap filling and application on vertical surfaces. Help solder joints around a heat tube (or heat sink) container. Reportedly wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper. 
 
EFD Inc., www.efd-inc.com
SIP and STRIP male pin headers feature sturdy 0.040" diameter leads; mate to standard SIP and STRIP female sockets. The double-row connector is offered standard in 8 (2x4) up to 100 (2x50) position configurations on 0.100" spacing. Reportedly creates a high current interconnect rated at 8 amps per position. The low-profile insulator (0.071" thick) is manufactured with high-temperature thermoplastic.  Standard and RoHS plating available. Use brass alloy 360 ½ hard.
 
Mill-max, www.mill-max.com

Hysol FP4581 and FP4583 are liquid epoxy encapsulants for use as underfills for flip-chip devices. FP4581 is formulated high-lead, bumped large die flip-chip packages. Is said to have low coefficient of thermal expansion properties and improved toughness over previous materials; forms a rigid, low-stress seal on solder joints. Is said to be ideal for flip-chip devices that require improved crack and fracture resistance. Is compatible with most no-clean flux systems. FP4583 is for applications requiring a fine filler. Contains fillers less than or equal to 2 µm in diameter; is formulated for overmolded components.

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