Zestron DS 100 solvent-based defluxing agent is for water-free and low-temperature cleaning applications. Is designed to remove flux residues from assemblies, ceramic hybrids, power modules and leadframes in self-regenerative closed-loop cleaning systems. Is said to ensure extended bath life, short cycle times and residue-free drying. Is halogen-free; meets new RoHS and WEEE guidelines.
 
Zestron America, www.zestron.com
 

e.dot+ compact electric hot melt adhesive guns are said to offer a combination of accurate dot or bead placement, easy installation and quiet operation, while requiring minimal space for installation and service. Reportedly ideal for high-speed dotting applications. Operate in combination with a small diameter hose and an external gun driver, permitting direct plug-and-play connections between the adhesive melter, gun, driver and hose. Are said to have on-times as low as 0.4 ms, cycle rates as fast as 1.8 ms, and a service life in excess of 200 million cycles. Features a removable armature and seat, and a number of interchangeable nozzles. Manual stroke adjustment permits re-zeroing of the module after servicing.

Nordson Corp., www.nordson.com
 

A dummy version of Amkor's FusionQuad lead frame-based plastic package is available. Is based on the addition of exposed bottom lands within a standard VQFP package format. Is said to extend the I/O range of classic leadframe packaging to nearly 400 unique pins; delivers an approximate 50% reduction in package size for a given leadcount. Reportedly provides short signal paths to bottom lands and high power dissipation capability with the solderable exposed die attach paddle.
 
Practical Components, www.practicalcomponents.com