Fusion3D 1100 uses laser direct structuring and molded interconnect devices to combine mechanical structures and electronic circuits into a single 3-D part. Uses LDS-grade resin laser activated by a scanner-based laser system. Circuit pattern is written directly onto the molded piece; conductive paths are plated using electroless plating technology, adhering only to where the plastic has been activated by the laser beam. For small-volume production.

LPKF Laser & Electronics, www.lpkfusa.com 

UA-2605 reworkable edgebond adhesive improves thermal cycle performance of CBGAs and plastic BGAs. In a trial, it reportedly tripled the 0° to +100°C performance of a CBGA to nearly 2,500 cycles.  Only four beads of adhesive required, one at each corner. No need to preheat board; no need to wait for underfill flow; no need for multiple dispensing passes.

Zymet, www.zymet.com

iSpector HMA and HDA AOI is a nine-camera system: one top-down camera and eight side cameras. Side cameras operate simultaneously. Includes wide FOV from multi-angles; full-color inspection, and high dynamic range CMOS side cameras + CCD main camera.

Marantz Electronics, http://us.marantz.com
Christopher Associates Inc., www.christopherweb.com

MY100e series pick-and-place machines are for high-volume production environments. Enable a fully automated material flow with fewer operators. Reportedly have seamless workflow from prototypes to volume production. Include four models: LXe, SXe, DXe and HXe, each in two sizes ranging from 16,000 to 50,000 cph, with a total of 96 to 176 feeder positions. Are compatible with existing range of Mydata machines, feeders and software.

Mydata, www.mydata.com