Genesis GX-37D is a multipurpose surface-mount platform, placing chips at high-speed. Combines Series 2 Lightning placement head with InLine7 head for a component range of 01005 passives to 150mm sq. Handles odd-form components up to 25mm tall with 2.5kg grams of placement force. Features nozzle-changer support for gripper nozzles. Provides standalone prototyping solution, or a line balancer capable of taking on component placements from up-line or down-line machines.
Universal Instruments Corp., www.uic.com
Genesis GX-37D is a multipurpose surface-mount platform, placing chips at high-speed. Combines Series 2 Lightning placement head with InLine7 head for a component range of 01005 passives to 150mm sq. Handles odd-form components up to 25mm tall with 2.5kg grams of placement force. Features nozzle-changer support for gripper nozzles. Provides standalone prototyping solution, or a line balancer capable of taking on component placements from up-line or down-line machines.
Universal Instruments Corp., www.uic.com
LED nozzles are designed to overcome the tackiness or stickiness of LED substrates. Use semi-rigid material made from organic compounds to create a vacuum bond with components. Reportedly improves LED component release onto the board, preventing misplaced LEDs, lost components or miss-picks. Can be applied to any style of pick-and-place nozzle for any OEM or machine type.
Count On Tools, www.cotinc.com
Agilis Flex feeder is for larger components. Now covers any component on tape or stick, and reportedly cuts loading and unloading times to a fraction of that of conventional feeders. Is capable of handling component tapes from 8mm up to 152mm in width. Pocket depths accommodate the thickest, tallest components.
Mydata, www.mydata.com
Agilis Flex feeder is for larger components. Now covers any component on tape or stick, and reportedly cuts loading and unloading times to a fraction of that of conventional feeders. Is capable of handling component tapes from 8mm up to 152mm in width. Pocket depths accommodate the thickest, tallest components.
Mydata, www.mydata.com
A new function for PowerSelective compensates product or production-related warpage of assemblies to be processed. During program generation for the mini-wave soldering process, the operator specifies all board areas that are mechanically supported and gives a correct z-level. A reference point is defined. The operator specifies an arbitrary number of points on the soldering side of the assembly. A high-precision laser measuring system determines the distance of the PCB from the previously defined points prior to soldering. These values and the z height of the reference point are the basis for a precise calculation for modeling and illustrating an altitude profile. All points of the soldering program are set off against the modeled value. PCB warpage compensation, with the automatic PCB alignment based on fiducial recognition, guarantees reproducible xyz positioning.
SEHO Systems, www.seho.de
Press Releases
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- STI Celebrates Christy Hill’s 20 Years of Dedicated Service; David Raby Comments