0.031" and 0.039" fine pitch wire to board range headers offer small printed circuit board footprints and low-profile mounted heights. Are shrouded and polarized; come in vertical or horizontal orientation. Mating height is 0.155" (in 0.031" pitch). Right angle headers offer a 0.069" mated height, with a footprint depth of 0.154" (in 0.031" pitch). Rated currents are 1.0A for 0.031" pitch and 0.5A for 0.039" pitch, with a temperature range of -13° to 185°F. Come in a selection of colors for polarization purposes.
GradConn, http://www.gradconn.com/Wire-To-Board/
UVCL UV cure coating is a VOC-free, 100% solids coating said to cure in seconds with conveyorized UV lamps, or within 2 hr. at 80C° due to a "multi-cure" mechanism that facilitates cure in shadowed areas. Reportedly has a 12-month shelf life. Is a single-component, low-viscosity coating formulated for "sharp-edge" coverage with common selective coating methods. Shadowed areas will cure in under 3 days at ambient temperatures and humidity, or can be accelerated by a 30-min. bake at 80°C. Meets IPC-CC-830 requirements and is UL94 V-0 rated. UL746E pending. Is said to be resistant to common thermal shock cycling, solvent and fluid exposure, moisture vapor, salt spray and condensing environments.
Electrolube, a division of H.K. Wentworth Ltd., www.electrolube.com
USTFA acrylic conformal coating is VOC-free, low viscosity and said to facilitate and optimize selective coating. Improves adhesion on difficult substrates. UL94 V-0 flammability rated. Is fast drying and meets IPC-CC-830 requirements (UL746E pending). Also comes in bulk for manual application.
Electrolube, a division of H.K. Wentworth Ltd., www.electrolube.com
Factory Intelligence Monitoring Module allows users to leverage data available in the TTC platform to calculate and monitor key process indicators over time. Provides an understanding of how machines and assembly lines are running as well as information regarding causes for non-production and material losses.
Cogiscan, www.cogiscan.com
MicroLine 2000 SI laser depaneling system is for rigid and flexible printed circuit boards. Reportedly benefits from a low-stress UV laser beam. Is for removing bare or populated circuits from panels. Reportedly can process any board material, from FR4 to fired ceramics to flexible and rigid-flex substrates.
LPKF, www.lpkfusa.com
Leica DCM8 combined confocal and interferometric optical profiler is for nondestructive 3D surface profiling. Provides high-def confocal microscopy for high lateral resolution and interferometry to reach sub-nm vertical resolution. Provides lateral resolution up to 140nm and vertical resolution of up to 0.1nm. Employs confocal scanning technology without moving parts in the sensor head. Includes four LED light sources: blue (460nm), green (530nm), red (630nm), and white (centered 550nm); has an integrated CCD camera with XY topography-stitching mode.
Leica Microsystems, www.leica-microsystems.com/dcm8