Renishaw's RenAM 500 Ultra laser powder bed fusion (LPBF) 3-D printer incorporates new scanning algorithms that allow the laser to fire while the recoater is moving, saving up to nine seconds per build layer.
Hirose Electric's DF51K wire-to-board connector series now includes a surface mount technology (SMT) version.
AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter.
Master Bond's UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.
Tagarno's T50 digital microscope is equipped with a 4K/60FPS block camera to provide users with a seamless and lag-free viewing experience.
Nordson Electronics Solutions' Asymtek Select Coat SL-1040 conformal coating system includes system-level advancements to elevate automation, control, precision and preventive maintenance for better yield and uptime.
Press Releases
- Inovaxe Welcomes Daniel Enríquez Gómez as Regional Sales Manager for Northern Mexico; Ben Khoshnood Comments
- Luminovo to Host Exclusive Webinar on How AI Agents Will Transform the U.S. Electronics Industry in 2025; Matthew Rosenberg Comments
- Indium Corporation Expert to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
- JAVAD EMS Successfully Passes AS9100 and ISO 13485 Certification Audits; Gary Walker Comments