EP54TC is a two-component, electrically insulating epoxy designed for heat sink bonding and thermal management applications requiring high thermal conductivity. Delivers thermal conductivity exceeding 6W/(m·K). Formulated with a 5–30µm specialty filler to support thin bond lines and efficient void filling, achieving thermal resistance of 5–7×10⁻⁶K·m²/W. Exhibits a tensile modulus above 1,000,000psi at room temperature and is serviceable from –73°C to +204°C. Features a recommended cure schedule of 2 hours at 80°C with a 2–4 hour post cure at 90–125°C, a mixed viscosity of 100,000–200,000cps, and a working life of 60–90 minutes. Available in ounce through gallon kit sizes for prototyping and production use.

RMCA automotive-grade thick film chip resistors from Stackpole are surface-mount components qualified to AEC-Q200 for use in automotive electronic applications. The series is designed for stable resistance performance under automotive operating conditions. RMCA resistors are manufactured on dedicated automotive production lines using controlled materials and process parameters.  The RMCA product line includes RMCA-HP and RMCA-UP variants, which provide increased power handling of approximately two to three times compared with standard RMCA devices of the same size. Devices are available in multiple case sizes, resistance values and tolerance options.

The YRH10W hybrid placer is a wide-type placement system designed to support both semiconductor die bonding and surface-mount component placement within one platform. Expands capability to accommodate 12-inch wafers and large-format printed circuit boards up to L510 × W460mm. Combines bare-die handling and SMT placement functions, delivering a bare-chip placement speed of up to 14,000 components per hour when supplied with wafers, along with placement accuracy of ±15µm. Designed for flexible production environments. 

The TR7600FB SII is a 3D automated X-ray inspection system. Optimized for specialized substrates, fine-pitch BGAs, multilayer boards and system-in-package (SiP) devices. Incorporates a newly developed X-ray imaging structure that allows the X-ray tube to operate in close proximity to the board surface without structural interference. This architecture supports detailed inspection of critical components requiring precise internal visibility. Powered by TRI’s AI Ecosystem, combining AI-driven inspection algorithms with metrology-based measurement capabilities. Supports AI Smart Programming.