ARLINGTON, VA – Memory technology for mobile devices will be featured at three Mobile Memory Forum events hosted by Jedec, taking place in Shenzhen on June 20; Hsinchu, Taiwan on June 22; and Seoul on June 24.

The series will highlight developments and standards for mobile memory, focusing on four technologies with major impact potential for the mobile device market: universal flash storage, LPDDR3, WideIO and solid state drives.

The LPDDR3 standard is designed to meet the higher bandwidth requirements of next-generation smartphones and tablets. The WideIO standard will meet industry demands for increased levels of integration, as well as improved bandwidth, latency, power, weight and form factor, providing performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other high-performance mobile devices. JESD220 is for universal flash storage, designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers. 

To register for the events, visit http://www.jedec.org/events-meetings.

SAN JOSE – North America-based manufacturers of semiconductor equipment posted $1.6 billion in orders in April (three-month average basis), up 10.8% year-over-year and up 1.1% sequentially, says SEMI.

The book-to-bill ratio was 0.98.

A book-to-bill of 0.98 means $98 worth of orders were received for every $100 of product billed for the month.

CHENGDU, CHINA -- Three workers are confirmed dead following a May 20 explosion at Foxconn Technology Group's Chengdu plant.

SANTA CLARA, CA -- Whizz Systems has begun installation at its new contract electronics assembly site in Kulim Hi-Tech Park, Kedah, Malaysia, the company told CIRCUITS ASSEMBLY.