EGHAM, UK – Global shipments of PCs, tablets and mobile phones are on pace to decline 13.6% in 2020, totaling 1.9 billion units, according to Gartner.
CAVE CREEK, AZ – High-Density Packaging (HDP) User Group is hosting a webinar to provide the latest information on standard requirements and developments in automotive electronics. The webinar will be held June 25.
SHANGHAI –The producers of Productronica China and its related shows confirmed it will be held here as scheduled in July.
KARNATAKA, INDIA – Incap has reopened its factory here after a government-mandated lockdown in response to the Covid-19 pandemic in March.
MILPITAS, CA — North America-based manufacturers of semiconductor equipment posted $2.26 billion in billings worldwide in April, up 17.2% year-over-year and 2.2% sequentially, according to SEMI.
WESTLAKE, OH – Nordson reported total fiscal second quarter sales were $529.5 million, down 3.9% year-over-year. Organic volumes fell approximately 3%, offset in part by growth from the first year effect of acquisitions of less than 1%. Currency translation compared to the prior year’s fiscal second quarter cost the firm approximately 1%.
Press Releases
- TT Electronics AnnouncesCEO Appointment
- Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium in Niskayuna, NY
- Clemsa Achieves up to 75% Faster Changeovers and Higher Quality with Europlacer SMT placement line
- Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan