WASHINGTON -- President-elect Joe Biden's emphasis on rebuilding US manufacturing capacity is reason for hope that his administration will support domestic programs, the head of government relations at IPC wrote this week.
MANCHESTER, OH – Contract manufacturer Mirac is opening an 11,800 sq. ft. facility here and is currently hiring 20 to 40 new assembly workers.
HERTFORDSHIRE, UK – The global TV market is on track to achieve 1.2% growth in 2020 and is set to end the year with more than 233 million shipments, according to Futuresource Consulting. Trade value is forecast to decline 1% to $83.7 billion.
BENGALURU – Wistron’s iPhone manufacturing facility in India was reportedly ransacked over the weekend, causing up to NT$200 million (US$7.1 million) in damage.
TOKYO – Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% year-over-year and register a new industry record of $68.9 billion in 2020, SEMI said.
MCLEAN, VA – US manufacturing technology orders totaled $383.8 million in October, down 1.9% year-over-year and up 3.7% sequentially, the highest dollar value since December 2019, according to the Association for Manufacturing Technology.
Press Releases
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
- TTCI Expands Southeastern U.S. Presence Through Partnership with Microwave Component Sources; Bert Horner and Ryan Peavey Comment
POPULAR
- Editorial Contributions
- How Squeegee Blade Profile Helps Improve the Screen-Printing Process
- Verifying PCBA Cleanliness with Ion Chromatography
- Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization