For the quarter ended June 30, Reptron recorded a pro-forma loss from continuing operations of $174,000, excluding reorganization expenses. This compares to a $711,000 loss a year ago. The net loss was $147,000, vs. $2 million last year.
Gross margins improved sequentially.
In February, Reptron emerged from Chapter 11 bankruptcy, having sold various assets of its components distribution and memory module divisions.
"Reptron Electronics continued on its road to recovery during the second quarter," said Paul Plante, president and CEO. "We continue to see signs of an improving economy through increasing customer demand."
"This is an important business development for Reptron that increases our capacity to provide manufacturing services for the communications industry sector," said Bonnie Fena, president of Reptron Manufacturing Services.
Full production is expected to ramp by the end of 2004.
Under the deal, Reptron will build 150 different subassemblies and PCBs for wired and wireless intercommunications products. Much of the current phase involves converting from plated through-hole to to surface mount technology.
Clinton, NY -- Indium Corp. (indium.com) has released the results of a series of cleaning solvent compatibility evaluations. After extensive testing and analysis, the company found a high degree of effectiveness using a range of cleaning solvents from Zestron and Kyzen for the Indium's solder pastes, including lead-free.
The data are available by contacting abrown@indium.com.
Indium is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
Net income was $8.6 million, vs. $5.1 million last quarter and $1.2 million last year.
First-half revenues were up 33% to $144.7 million and net income rose 491% to $13.6 million.
PCB equipment sales were $29.4 million, up from $23.2 million sequentially and $18.5 million last year. Sales of assembly equipment were $8.8 million, up from $6.6 million in the first quarter and $6.1 million a year ago.
Cash and equivalents increased $14 million to $166 million during the quarter.
"Our confidence in the long-term growth prospects of these
industries continues to be high," said CEO Yochai Richter in a press
statement.
Wang's talk will focus on enabling technologies and processes for higher quality and lower costs in a lead-free environment. Also on tap: overviews of press fit and pin insertion technology, and selective soldering .
The one-hour presentation takes place Sept. 1 at 2 p.m.
Contrary to published reports, Nepcon Shenzhen will take place at the China Hi-Tech Fair Exhibition Centre in Shenzhen, not Beijing. For more information click here (www.nepconchina.com).
Ruwel AG and Fuba Printed Circuits, which have joint sales of 270 million euros (about $325 million), say their combined buying power has the potential for "considerable savings" on raw materials. The companies also plan to coordinate sales and production efforts, in order to reverse downward pricing pressure and benefit from economies of scale.
Ruwell operates plants in Goch, Wetter, Grassau, Pfullingen, Nykøbing and and two in Geldern.
Fuba has plants in Gittelde, Dresden, and has JVs in Tunisia and India. The capacity of the Tunisia factory was recently increased by 80,000 m², to 200,000 m² per annum. Additional expansion will take it to 320,000 m² by year-end.
Press Releases
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- Scanfil Boosts Investment in Electronics Manufacturing in the US; Christophe Sut Comments