HERNDON, VA—The International Electronics Manufacturing Initiative (iNEMI) has released two documents to help manufacturers reduce the risk of tin whiskers in lead-free products.
The first is JEDEC standard JESD22A121, "Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," and the second is the updated "Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," from the iNEMI Tin Whisker User Group.
The JEDEC standard provides: an industry-standard method of measuring and comparing whisker propensity for different plating or finish chemistries and processes; a consistent inspection protocol for tin whisker examination; and a standard reporting format.
Long a center of R&D for the company's line of solder products, the facility is now also home to several other complementary Henkel businesses, including automotive electronics, industrial and automotive adhesives and sealants.
The addition includes several new laboratories: an applications lab for adhesives and sealants, a metal pre-treatment and coatings lab, analytical laboratories, an equipment assembly area long enough for a complete automotive vehicle and a long-term corrosion testing area.
The 1,500 sq. meter facility will be the company's base in China, providing local-language technical support from the Cookson's three electronics companies (the Assembly Materials Group, Enthone and Polyclad) to fabricators and assemblers of PCBs, and assemblers of semiconductor packaging.
"This expansion is in direct response to our dynamic growth and success in the marketplace," said Dieter Manz, president. "The new facility, together with the anticipated hiring of 20 additional engineers, provides us with sufficient capacity for future expansion and represents our commitment to serve our worldwide customers."
The building is environmentally friendly, with a roof-mounted solar power system that generates about one-third of the facility's annual electricity requirements.
Manz Automation AG is a supplier of automated odd-form assembly equipment to the electronics industry.
POMONA, CA -- Everett Charles Technologies (ECT) has named Patrick T. Flynn president. Previously president of ECT's Capital Equipment and Services Group and Semiconductor Test Group, Flynn succeeds David R. Van Loan, who was recently appointed president of Dover Technologies, ECT's parent company. Van Loan will remain the CEO of ECT during his transition to DTI.
Since joining ECT in 2000, Flynn has been instrumental in the development of several new products and spearheaded ECT's expansion into China when he established wholly owned operations in Suzhou and Shenzhen.
ECT is a manufacturer of electrical test products and services, including semiconductor test products, bare-board automatic test systems, Pogo test contacts, and bare and loaded PCB test fixtures and programs.
NEW TRIPOLI, PA -- While IC demand will grow 32% in 2005 to $45 billion, internal IC production will reach only $9 billion despite ongoing massive semiconductor fab construction.
According to a report by The Information Network (theinformationnet.com), China's IC industry is expanding rapidly. In 2005, China will produce 22 billion ICs, which will account for only 20% of domestic demand. Most high-end products used in computers and mobile phones must be imported.
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