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GREENVILLE, SC -- Kemet Corp. today said it is in "advanced" negotiations to acquire the tantalum capacitor business of Epcos AG. The deal is expected to close early next year, and no financial terms were disclosed.

Separately, however, Epcos said the proceeds of the sale would improve its net cash flow by at least 70 million euros.

In a press release, Kemet said the acquisition would increase its access to key markets including automotive and telecom and broaden its manufacturing base.

The deal hinges on the completion of a definitive agreement, among other customary business.

Epcos is based in Munich. The tantalum capacitor business was reportedly profitable business until 2001, but since has been hurt by overcapacity and falling prices.
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ST. LOUIS  -- LaBarge Inc. today announced net sales will be approximately $39.6 million, down 9.2% from $43.6 million a year ago.

For its fiscal 2006 first quarter, ended Oct. 2, net earnings are expected to be $0.12 to $0.13 per diluted share, compared with $0.15 per diluted share in the comparable period a year ago.

The results would be consistent with previous guidance. In its earlier guidance, the company forecast sales of $41 million to $42 million, and diluted earnings per share of $0.12 to $0.13.

Profit margins improved during the quarter. Sales fell below projections because of several customers rescheduling shipments.
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LAGUNA, PHILIPPINES -- Shareholders of Speedy-Tech Electronics Ltd., a
Singapore-based EMS and power electronics company, have approved the company's merger with Integrated Microelectronics Inc., a Philippines-based electronics manufacturing service provider.

The merged entity would have a combined revenue of $265 million and profit after tax and minority interests of about $30 million, based on the latest 2004 audited financials.


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ENDICOTT, NY -- Endicott Interconnect Technologies, IBM's former manufacturing arm, has teamed with Universal Instruments Corp. to automate and maximize production of very large, complex printed circuit cards and assemblies.

Endicott Interconnect, which builds PCBs, assemblies and chip packages, is using Universal's Advantis Flip Chip placement system and Polaris multi-process assembly machines to fully automate production of a high-performance chip carrier for a leading military supplier.

The product has several hundred surface-mount components, several memory devices and a very large heat spreader, Endicott Interconnect said in a press statement.

"Due to the mission critical nature of the product, we require stringent accuracy along with the ability to gang pick- and-place the larger components and sophisticated parts tracking," said Raj Raj, Endicott Interconnect senior engineering manager. "In partnership with Universal, we are able to achieve an advanced and innovative solution for these unique manufacturing needs."
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WEST CHICAGO, IL -- Connectors used in instrumentation products are a $700 million market and growing, said a new research report.

Bishop & Associates says sales of connectors used in instrumentation applications will grow to over $1 billion by 2009. 

The 200-page research report also notes that the instrumentation market is not moving to China, provides high profit margins and growth that exceeds industry averages.
 
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MIDLAND, MI — Dow Chemical will increase prices for all grades of epoxy resins sold in North America by $0.05/lb, the company said today. The increases are effective Nov. 1, 2005, or as contract terms permit.

Dow said the increase is driven by various factors, including additional increases in feedstock and energy prices, and difficulties in transporting key raw materials due to the combined impact of Hurricane Katrina and Hurricane Rita in North America.

Epoxy resins are used in laminates for printed circuit boards.
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