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SAN JOSE -- Bay Area executives are gaining optimism over their prospects, according to a quarterly survey.

Optimists outnumbered pessimists by more than four to one in the Silicon Valley, according to the quarterly Bay Area Business Confidence Index. The survey of 542 top executives was conducted in October by consulting firm McKinsey.
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DALLAS, OR -- Printed circuit board maker TTM Technologies will shutter its Dallas, OR, facility, and lay off about 300 workers, the company said.  TTM expects to take a charge of $2.6 million for severance in the first quarter of 2007.

Production will be moved to other company sites, primarily in Logan, UT, and Redmond, WA.


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PENANG, MALAYSIAPac Tech will open a high-volume wafer bumping facility in Penang next year. The 40,000 sq. ft. location will be completed in June and will be designed for mass production of wafer bumping using electroless NiAu, solder stencil printing, wafer sawing, solder-ball placement and more. The facility will reportedly be able to process 600,000 wafers annually to start. The company will begin producing in volume in October. 
 
 
BRUSSELS -- The EU Commission has opened discussions for its latest round of requests for exemptions to the RoHS Directive.

A list of proposed exemptions is available here.

Among the requests: That all uses of lead in solders be exempted on the grounds that the replacements are more environmentally damaging than the leaded versions.

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WASHINGTON — Some U.S. Environmental Protection Agency staff are looking at removing lead from a 30-year-old list of air pollutants, and could recommend the same to the Bush administration.

In an EPA staff paper released Tuesday, agency said it would evaluate the status of lead as an air pollutant and "assess whether the revocation of the standard  is an appropriate option for the Administrator to consider."
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TORONTOSMTA is seeking papers for a conference on soldering and reliability to be held in Toronto this spring. To present a paper, submit a 200- to 300-word abstract. Suggested topics include SnPb with Pb-free components; reliability; harsh environment; tin whiskers; new alloys; electromigration; thermal dissipation; manufacturing process; supply chain issues; advanced packaging; new substrate materials; surface finishes; thermal interface materials, and underfill. The SMTA did not specify the precise dates of the conference. Abstracts are due Jan. 18 to Melissa Serres at melissa@smta.org. Include a title, author name and contact information. Authors will be notified of acceptance by Jan. 31. PowerPoint presentations are required and will be due March

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