PALO ALTO -- Hewlett-Packard scientists this month disclosed a new way to make nanoscale computer chips that reportedly increases by eightfold the number of transistors on a chip, without making the transistors smaller.
The HP team's concept involves layering a structure called a nanowire on top of a conventional silicon chip, to increase the number of interconnects. Also, most of the wiring from the silicon is removed, allowing the more transistors to be crammed on the chip.TAIPEI -- Is ODM Asustek Computer going to follow the path blazed by Acer, BenQ Mobile and others and go head-to-head with its customers?
That's the talk -- and it's coming from the company itself.
Company spokesman Jonathan Tsang told DigiTimes the company plans to split its ODM and OEM production within three years.
Asustek builds and markets motherboards, notebook PCs, servers, handsets and LCD TVs under the Asus brand. Sales from Asus notebooks are nearing those of contract revenues, Tsang said.
No decision has been made but the company plans to make a separation in three years, DigiTimes reported Tsang as saying.
This event will be held Sept. 18-19 in San Jose, and will focus on leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging.
The event includes one day of workshops, a two-day technical program and two days of exhibits.
Submit 200-word abstracts to Melissa Serres at melissa@smta.org by March 23.
Multi Dicona has more than 13 years’ experience in the printed circuit board industry and is working toward ISO 9000 certification.
Gaining certification were Dale Fuller, Brad Klepsa, Marcus Koh, Jim Krzmarzick, Jeff Salisbury, Keith Smith and Luis Velazquez.
The test was developed and graded by the Program Manager Certification Council.
ESDA will host the first annual Device Design Certification Exam in September during the association’s 2007 EOS/ESD Symposium in Anaheim, CA. Details regarding the exam are available at www.esda.org/devicedesign.html.
