SOUTH PLAINFIELD, NJ – Cookson Electronics is launching its Zero halogen initiative for its Alpha branded products to assist in the selection of materials that have either zero halogen content or trace levels based on published standards.
“Halogenated compounds can be found in printed circuit boards, solder masks, mold compounds, connectors and other products often found in electronic products,” said Bruce Moloznik, VP global marketing, Cookson Electronics. “Given the rising concern regarding the potential human health and environmental dangers posed by halogens, we have initiated an ongoing process to certify Alpha products that have zero halogen content and those considered halogen-free according to published IPC, IEC and JPCA standards.”
The byproducts of the incomplete combustion of circuit boards and electronic products that contain halogens can include dioxin and furan-like compounds and acidic or corrosive gasses, says Cookson.
“Halogenated compounds can be found in printed circuit boards, solder masks, mold compounds, connectors and other products often found in electronic products,” said Bruce Moloznik, VP global marketing, Cookson Electronics. “Given the rising concern regarding the potential human health and environmental dangers posed by halogens, we have initiated an ongoing process to certify Alpha products that have zero halogen content and those considered halogen-free according to published IPC, IEC and JPCA standards.”
SAN JOSE, CA – Spending on worldwide fabs equipping is expected to show declines of about 17% in 2008, as more companies are forced to postpone fab projects because of global economic uncertainties, says SEMI.
EL SEGUNDO, CA – iSuppli Corp. has trimmed its long-term growth forecast for global electronics contract manufacturing revenue to 8% during the 2006 to 2013 timeframe, down from its previous outlook of a 9.3% expansion.
EDINA, MN – The SMTA seeks abstracts for the Pan Pacific 2009 Symposium.
The program committee seeks participants to present recent research results on any of the following topics: business; packaging; interconnection; markets; assembly; microsystems and nanosystems technology, and solar electronics.
Abstracts of 500 words should be submitted by July 31, with title and author contact information.
For online submissions, visit smta.org/panpac/call_for_papers.cfm or submit abstracts to JoAnn Stromberg at joann@smta.org.
The program committee seeks participants to present recent research results on any of the following topics: business; packaging; interconnection; markets; assembly; microsystems and nanosystems technology, and solar electronics.
Abstracts of 500 words should be submitted by July 31, with title and author contact information.
For online submissions, visit smta.org/panpac/call_for_papers.cfm or submit abstracts to JoAnn Stromberg at joann@smta.org.
GENEVA – The US and Japan have filed complaints with the World Trade Organization over tariffs the European Union imposes on certain electronics devices.
MIDLAND, MI – Dow Epoxy plans to raise prices in North America and other world regions as necessary, in response to the current climate of rising costs and shrinking margins.
“Profit margins have substantially eroded in the face of step-change hydrocarbon and energy and other manufacturing costs, and the situation shows no signs of improvement,” said Patrick Ho, business group president, Dow Epoxy & Specialty Chemicals. “We have absorbed our share of the increased costs, but we have no more room and must act immediately and definitively to ensure our business is healthy over the long-term.”
The business is currently meeting with customers to discuss market issues and upward price movement primarily driven by rising costs. Dow incurred new hydrocarbon and energy costs of greater than $2 billion in the first quarter of 2008, and an additional $665 million so far in the second, the company said.
