LYON, FRANCE – Overall memory packaging revenue is estimated to have been US$15.1 billion in 2022, excluding testing. This corresponds to around 10% of overall stand-alone memory revenue, around US$144 billion in 2022. Yole Intelligence, part of Yole Group, forecasts that revenue will reach US$31.8 billion in 2028 with a CAGR22-28 of 13%.

According to Thibault Grossi, Senior Technology and Market Analyst, Semiconductor & Software Division at Yole Intelligence: “In terms of packaging revenue, DRAM will grow with a CAGR22-28 around 13% while NAND will grow faster, with a CAGR22-28 of 17%. Other memory technologies, such as NOR Flash, EEPROM, SRAM, and emerging NVM, are forecasted to grow with a CAGR22-28 of around 3%.”

AP has become a key enabler of technological progress for NAND and DRAM. Among the different AP approaches, hybrid bonding has emerged as the most promising solution to manufacture higher bit density and higher-performance memory devices.

Whether its use is intended to enable higher performance or smaller form factors, advanced packaging is an increasingly important factor in the memory value equation. From representing about 47% of memory packaging revenue in 2022, AP will represent 77% by 2028.

In this context, Yole Intelligence releases its new product: Memory Packaging 2023 report. In this study, the company – part of Yole Group – presents an overview of the semiconductor memory market, provides an understanding of memory packaging technologies and markets, and offers market forecasts for memory packaging. This report also describes the memory packaging business and delineates and analyzes the competitive landscape.

Wire-bond is the dominant packaging approach. It is widely used for mobile memory and storage applications, followed by flip-chip packaging, which continues expanding in the DRAM market.

The adoption of flip-chip packaging with short interconnects is essential to enable high bandwidths per pin. While wire-bond packaging may still meet DDR 5 performance requirements, analysts expect flip-chip packaging to become a must-have for DDR6.

Leadframe remains widely used for NOR Flash and other memory technologies and is the package with the highest volume of unit shipments.

WLCSP is being increasingly adopted for consumer/wearable applications requiring small form factors, such as True Wireless Stereo earbuds. It is found in low-density memory devices such as NOR Flash, EEPROM, and SLC NAND.

STEINACH UND BAAR, SWITZERLAND – Variosystems, an international electronics services provider, strengthens its expertise in the development and industrialization of electronics solutions by acquiring KUBEG, a rapid prototyping and small series electronics solutions company based in Zizers, Switzerland. The integration into the Variosystems Group will enhance the company’s services portfolio, resulting in the launch of the VARIOincubator.

The VARIOincubator targets customers that aim to develop and industrialize their electronics products in an agile and technology-driven environment. A dedicated team of engineers, technology and manufacturing specialists supports customers from the spark of an idea all the way through to series production and life-cycle management of electronics solutions. «As of today, we are able to build a prototype for our customers within a matter of days, so that they can quickly and reliably validate their electronics solutions, and plan and implement the industrialization together with our team, » says Julian Specker, Head of the VARIOincubator.

Recent years have seen a sharp rise in the demand for technology services of product development and life-cycle management activities. With the integration of KUBEG, which specializes in rapid prototyping and small series production for printed circuit board assembly (PCBA) and box build assembly (BBA), Variosystems underlines its ambition to support customers along the entire value chain, from development through industrialization, manufacturing to life-cycle management. Variosystems will maintain the site in Zizers (Graubünden) along with its current portfolio of services, and will continue to develop its expertise in rapid prototyping and small series production. The existing management team and employees will become part of the Variosystems Group. «We are pleased to continue offering our customers a flexible and attractive development and production platform, and that we now have access to Variosystems' international manufacturing network for scaling customer projects,» says Kurt Egger, founder and General Manager of KUBEG.

The acquisition of Solve Engineering in 2020, the current integration of KUBEG and the launch of the VARIOincubator are underlining Variosystems’ strategy to support customers along the entire electronics solutions value chain. With this acquisition, the company positions itself as an innovative solution provider that helps its customers launch their electronics products faster and more reliably and to scale those with the engagement of the Variosystems team internationally. The company intends to expand the VARIOincubator with leading engineering and technology providers in the field of electronics services. This includes third-party engineering companies looking for a strong development partner, as well as suppliers whose products complement Variosystems' offering. «We are positive that the VARIOincubator enhances our customers in the development and industrialization of electronics solutions, supports their nearshoring initiatives and offers them an inspiring environment of talented engineers, technology specialists and network partners for innovative electronics products, » says Stephan Sonderegger, CEO of Variosystems

HAUPPAUGE, NY – Orbit International Corp. (OTC PINK:ORBT), an electronics manufacturer and software solution provider, announced today that the filing of its 2022 Annual Report with the OTC has been delayed beyond its extended due date of April 17, 2023, as additional time is needed to complete the audit of the acquired and ending inventory of its recently acquired Simulator Product Solutions LLC subsidiary (“SPS”) and the preparation of the 2022 Annual Report.

Mitchell Binder, President and CEO commented, “Some additional time is needed to complete our filing as our auditors complete their audit of the acquired inventory of SPS on January 3, 2022, as well as its ending inventory at December 31, 2022. Because the acquired inventory comprised a part of the purchase price of SPS, any one-time adjustments should have no material effect on the financial statements of Orbit. Furthermore, we do not expect any adjustments to SPS’ ending inventory to have any material effect on the financial statements of the Company. Based on the amount of work expected to be completed by the Company and its auditors, we anticipate filing our 2022 Annual Report in approximately two to three weeks.”

Binder continued, “Although our final financial results are subject to the completion of our audit, our sales for the fourth quarter are expected to be in the range of $7,000,000 to $7,500,000 and our net income is expected to be in the range of approximately $450,000 ($0.13 per diluted share) to approximately $600,000 ($0.18 per diluted share). Our sales for the year ended December 31, 2022, are expected to be in the range of approximately $25,600,000 to $26,100,000, and our net income for the year is expected to be in the range of approximately $200,000 ($0.06 per diluted share) to approximately $350,000 ($0.10 per diluted share). Our backlog at December 31, 2022 was approximately $19,400,000, an increase of 9% from the prior year.”

Binder concluded, “Our financial position continues to be strong. As previously reported, we recommenced our share repurchase program in the second quarter of 2021. We continue to purchase shares under the program and have purchased 180,685 shares since the commencement of the program. As previously reported in March 2023, our Company declared a quarterly $0.01 per common share dividend and a $0.03 per common share special dividend payable at the end of this current month.”

CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 9-11, in Nuremberg, Germany.

Tuesday, May 9

• Materials for Low Warpage Power Module Assembly: Energy and C02 Reduction Through Low-Temperature Processes by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch
  • • This presentation examines different material properties, such as CTE (coefficient of thermal expansion), which cause assembly difficulties at higher process temperatures. Lowering peak temperature during soldering counteracts this and saves additional energy.
    • The presentation will be given in German.

Wednesday, May 10

• Power Electronics Materials and Process Optimization by Product Manager – ESM/Power Electronics Joe Hertline
  • This presentation will analyze key power module packaging architectures and corresponding soldering, sintering, thermal interface, and assembly materials solutions that can increase product life, enable manufacturing scalability, and reduce cost of ownership.
• The Role of Sintering Materials Technology in EV Power Module Applications by Product Manager – Semiconductor Dean Payne
  • In this presentation, Dean will examine how sintering is used in die-attach and substrate-attach applications and how technological advancement of this material enables a more efficient manufacturing process in EV power module assembly.

Click here for additional information, including times and locations for all Indium Corporation presentations at PCIM. All presentations will be given in English unless otherwise noted.

Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.

Joe is responsible for driving the growth of Indium Corporation’s power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Joe also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

Dean is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which includes high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #460.