Press Releases
SANFORD, NC – SCS now manufactures a series of bags and film to MIL-PRF-81705E Type III, Class 2.
BANNOCKBURN, Ill., USA, January 26, 2017 — IPC President and CEO John Mitchell has been elected to serve on the National Association of Manufacturers’ (NAM) Council of Manufacturing Associations (CMA) Board of Directors.
Saint-Egrève, France, January 2017 — Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will participate in the Innovations Forum 2017 – Leaders Conference, scheduled to take place March 9, 2017 in Boeblingen, Germany. Vi TECHNOLOGY company representatives will discuss how the company has coupled its 5K3D AOI with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.
Duluth, GA, January 2017 — IPC APEX EXPO, booth 3121 — At the upcoming IPC APEX EXPO, Viscom will present the latest generation of its inspection systems and solutions.
At this year’s APEX, February 14-16, San Diego, ASM Assembly Systems presents visitors with a full scale Smart #1 Factory that they can walk through and interact with.
Milledgeville, Georgia, USA – TopLine, a leading designer and manufacturer of electronic components and packaging solutions for PCB assemblies, will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments.
Press Releases
- NanoFlowX Announces Strategic Partnership with Bentec Ltd to Accelerate PCB Protection Innovation Across Europe and India
- Strong signal for the industry: productronica 2025 drives positive industry trend
- Sharpen Your ESD Skills: CE3S Announces Desco’s First ANSI/ESD S20.20 Training Series for 2026
- Mycronic Secures Turnkey Solution Order from a Nordic Defense Actor