Zentech Manufacturing, Inc., in support of a major customer engagement in the Homeland Security market segment, is pleased to announce the addition of a sub-Class 5 Clean Room operating environment.
Somerset, NJ – February 8th, 2016 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is pleased to announce a new stencils partnership with STP Electronics for the French market, commencing the 1st February 2017.
Salem, NH, USA, February 2017 -- Seica will be exhibiting at the Apex show held in San Diego this year showing our expanding lines of test and assembly equipment.
Duluth, GA, February 2017 — With the newest vVision release, Viscom offers an intelligent software solution for mobile devices. This brings even greater versatility to the inspection of electronic assemblies. The user is given an overview of the widest range of key figures from his production process, and can retrieve information about products faster than ever.
February 07, 2017 – Rolling Meadows, IL – Panasonic Factory Solutions Company of America will premiere Smart Factory Solutions for “Any Mix Any Volume” at IPC APEX 2017 in booth #1542 on February 14-16 in San Diego, CA.
Technical paper provides new insight into low cycle fatigue life of solder joints in electronic packages with encapsulations
Beltsville, MD – February 7, 2017 – DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that its technical paper, "Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints," will receive an Honorable Mention at the 2017 IPC APEX EXPO. Authored by DfR Solutions’ reliability experts Dr. Craig Hillman, Maxim Serebreni, Dr. Nathan Blattau, and Dr. Gilad Sharon, the paper explores the effect of polymer encapsulations on solder joints as it relates to reliability.