SAN JOSE, CA – NextFlex, America’s Hybrid Electronics Manufacturing Innovation Institute focused on additive microelectronics manufacturing for novel applications and complex integrated systems, announced the appointment of Dr. Daniel Gamota, a well-known and experienced manufacturing and technology executive, to lead NextFlex into its next chapter as Executive Director, effective September 1, 2024. Dr. Gamota succeeds Dr. Malcolm Thompson, the inaugural Executive Director of NextFlex.

NextFlex leads a consortium of companies, academic institutions, non-profits, state and local governments, and federal government agencies that collaborate to advance the technology, manufacturing, and commercialization of hybrid electronics, to establish a sustainable domestic manufacturing ecosystem in support of the technology, and to accelerate the growth of the current and future manufacturing workforce. Established in 2015 in San Jose, CA, NextFlex is a public-private partnership supported by the U.S. Department of Defense under a Cooperative Agreement with Air Force Research Laboratory (AFRL) and is part of the Manufacturing USA® network.

"On behalf of NextFlex, I’m delighted to announce Dr. Gamota’s appointment to lead the NextFlex Manufacturing Innovation Institute into its next phase. Having been an active and long-standing member of NextFlex through his role at Jabil, Dr. Gamota consistently demonstrates his strategic support for the mission of the Institute and its members and partners," said Dr. Robert Smith, Boeing Executive Technical Fellow, and Chair of the NextFlex Governing Council. "Hybrid electronics technology is at a critical inflection point – as it increasingly is integrated into volume manufacturing for both commercial and defense applications, it’s more important than ever that NextFlex continues to align the manufacturing ecosystem and accelerate the growth of the workforce of tomorrow."

Dr. Gamota has more than 25 years of experience leading large organizations such as Jabil, where he served as Vice President, and Motorola, where he served as Director & Fellow of the Technical Staff, both of which industrialized innovative products and deployed advanced microelectronics manufacturing operations to international high volume production sites. He is recognized for leading R&D and collaborative innovation teams spanning Semiconductor Foundry (middle end of line and backend of the line), Semiconductor Assembly, Packaging & Test, Complex Integrated Systems Assembly, and Printed Circuit Board Assembly operations. Dr. Gamota is a proven P&L leader of global engineering, operations, and business teams that developed, deployed, and sustained microelectronics-based product manufacturing that resulted in revenue growth, expanded margins, and increased free cash flow.

Dr. Gamota has a strong record being awarded and leading several multi-member microelectronics systems solutions development programs (DARPA, NIST ATP, etc.). He is a member of the SEMI Board of Industry Leaders, University of Michigan MSE External Advisory Board, and San Jose State University Engineering Industry Advisory Council, providing strategic technology, market, and workforce development guidance. Also, Dr. Gamota is active in and has chaired committees developing microelectronics guidelines, standards, and roadmaps for IEEE, iNEMI, IPC, IEC, A*STAR, and SEMI.

Dr. Gamota was elevated to a NextFlex Fellow, IEEE Fellow, and was named a Dan Noble Fellow at Motorola for his contributions and leadership in microelectronics design, materials, packaging, processes, manufacturing, assembly, and testing. He earned a Ph.D. in engineering from the University of Michigan and a Master of Business Administration from the Kellogg School of Management at Northwestern University.

"I am excited to lead NextFlex as it evolves to become an engine for product industrialization and commercialization of a portfolio of innovations, a pipeline for talented workforce, and a strategic partner to volume manufacturing services providers and OEMs. NextFlex has the foundational tenets - talent, funding, programs, operational structure, and facility - to ensure it continues to be globally recognized as the nexus for Hybrid Electronics innovation," said Dr. Gamota. "I believe that NextFlex must continue to demonstrate agility in navigating the multidimensional complexities impacting the Electronics Manufacturing Ecosystem: workforce, supply chain resiliency, sustainability, and technology innovation. I also look forward to leading the NextFlex community as it continues to foster strong collaboration with Ecosystem members that represent diverse industry, academic, and government groups driving key enabling R&D topics."

Dr. Gamota’s appointment marks the beginning of NextFlex’s tenth year of operations. During this time, NextFlex has grown its membership to more than 210 organizations, managed over $400M in 240 technology and manufacturing development projects, served more than 25,000 students around the country with its education and workforce development programs, established three regional U.S. nodes in Massachusetts, Missouri, and New York, outfitted an end-to-end pilot scale design, prototype and manufacturing facility in Silicon Valley, and produced annual technology and manufacturing roadmaps to guide and de-risk investment for the member community.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum taking place September 11 and 12 at Expo Guadalajara Salón Jalisco Hall D & E, Guadalajara, Jalisco Mexico. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

In addition, AIM Technical Support Engineer David Solis will be giving a presentation titled Addressing Challenges and Solutions for M0201, 008005 and Micro/MiniLEDs:
The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss the new information on how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Guadalajara Expo & Tech Forum at Booth 110 September 11-12th, or visit www.aimsolder.com 

HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce its participation in SEMICON India 2024, taking place Sept. 11-13, 2024 at the India Exposition Mart Limited (IEML), Greater Noida. PVA will be co-exhibiting with its representative Maxim SMT Technologies in Hall 3, Stand O36.

Paul Kim, PVA's Asia-Pacific Sales Manager, will be in attendance offering insights into PVA’s latest technologies and solutions. Visitors will have the opportunity to discuss PVA’s comprehensive range of high-precision dispensing and conformal coating systems, designed to meet the demanding requirements of the electronics manufacturing industry.

PVA’s automated systems are recognized for their accuracy, repeatability, and reliability, making them essential for a wide range of applications in electronics, aerospace, automotive, and medical device manufacturing. At productronica India, PVA will highlight its expertise in delivering tailored solutions that enhance manufacturing efficiency, reduce costs, and improve product quality.

Whether you are looking to optimize your production processes or explore new application possibilities, PVA’s team will be available to discuss your specific needs and how their solutions can help achieve your manufacturing goals.

Join PVA and Maxim SMT Technologies at SEMICON India (H3.O36) to discover how PVA’s innovative solutions can elevate your manufacturing capabilities.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

SEOUL ― PEMTRON, an inspection equipment developer and supplier, is pleased to announce its participation in SEMICON India 2024, where the company will be showcasing its state-of-the-art inspection systems in Booth H3Q11. The event will be held at the India Exposition Mart Limited (IEML) in Greater Noida and will be co-located with electronica and productronica India.

Featured Inspection Systems:

MARS System
PEMTRON’s MARS system is a high-speed Automated Visual Inspection (AVI) solution specifically designed for memory modules. Renowned for its precision and reliability, the MARS system utilizes advanced image processing technology to deliver accurate inspection results at remarkable speeds. Its robust design ensures consistent performance, making it an essential tool for memory module manufacturers aiming to enhance quality control and production efficiency.

APOLLON System
The APOLLON system, tailored for package inspection, supports a wide range of package types including BGA, LGA, QFN, QFP, CSP, and SOP. APOLLON excels in real-time defect identification and automated reporting, significantly enhancing manufacturing efficiency and minimizing downtime. By promptly detecting and addressing defects, the system maintains high standards of quality throughout the packaging process.

8800WI Wafer Inspection System
The 8800WI wafer inspection system employs advanced 2D and 3D imaging technologies to inspect various types of bumps, including micro bumps. This system is crucial for identifying and addressing quality issues early in the semiconductor manufacturing process. Its cutting-edge imaging capabilities allow for detailed inspection, ensuring that even the smallest defects are detected and rectified.

Visitors to PEMTRON's booth can experience demonstrations of these cutting-edge inspection systems, featuring videos of the equipment in action. Don't miss the opportunity to learn more about how PEMTRON's solutions are shaping the future of semiconductor inspection. Visit Booth H3Q11 to explore the MARS, APOLLON, and 8800WI systems firsthand and discover how they can elevate your manufacturing operations.

For more information about PEMTRON, please visit www.pemtron.com