Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing at productronica 2017.
COLORADO SPRINGS, CO — October 2017 — Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, today announced plans to exhibit in Hall A3, Stand 443 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München, in Germany. Company representatives will demonstrate the TWEEZER-VAC® ELITE and PORTA-WAND® ELITE Kit.
Markham, ON ― October 2017 ― Acculogic Inc., a global leader in electronic production test solutions, announces that it will exhibit in Hall A1, Stand 465 at productronica, scheduled to take place Nov. 14 – 17, 2017 at the Messe München, in Germany.
Aylesbury, Buckinghamshire, UK — October 2017 — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces plans to exhibit at the 14th annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place Oct. 24-26, 2017 in San Jose, CA.
Chelmsford, Essex, UK – 11 October 2017 – Pillarhouse International today announced: Over recent years there has been a big push to try and remove wave soldering from the through -hole assembly process. This is not always possible.
Bannockburn, Ill., USA, October 11, 2017 — IPC — Association Connecting Electronics Industries® announces the addition of Nate Carson as director of business development to its staff at IPC headquarters in Bannockburn (Chicago), Ill.