Press Releases
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.
Täby, 7 February, 2018 - Mycronic AB (publ), has received an order for several systems of the MYPro series from a large Taiwanese contract manufacturer of electronics.
TAMPA, Fla.--(BUSINESS WIRE)--Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc. (Nasdaq/GM: SYPR), announced today that it has recently received contract awards to manufacture a variety of mission-critical electronic assemblies for a number of global undersea communication projects.
Chester, Connecticut, USA – Ascentech, LLC will exhibit and highlight INSPECTIS AB’s range of reliable, cost-effective high-definition camera microscopes, as well as GEN3 Systems’ Gensonic Stencil Cleaner and AutoSIR2™ test system (surface insulation test system) at APEX 2018 in San Diego this month in booth #3516.
East Pittsburgh, Pa., February 7, 2018 – Intervala, LLC, a full-service manufacturer of high-reliability, precision electronic and electromechanical products, announced today that it has implemented Valor® DFM software, expanding its capability offering to include comprehensive DFM (design-for-manufacturing) analysis for complex circuit card assemblies.
GOEPEL electronic once again generated record sales in the 2017 financial year. International sales in particular enjoyed record growth for 2017. With sales of around 38.5 million Euros (48 million USD), the record sales number achieved for 2016 was exceeded by 10 percent, demonstrating continued healthy growth for the company.
