(2018-10-17) Kitron and Magseis ASA has entered into an agreement to manufacture Magseis' MASS (Marine Autonomous Seismic System) nodes to support their growth.
October 17th, 2018 ― Cranston, Rhode Island USA ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Timothy O’Neill, Technical Marketing Manager, will lead a discussion about the evolution and development of solder alloys at the SMTA Atlanta chapter meeting on October 25, 2018 at Prime Technical Services in Suwanee, Georgia.
“Diverse, exciting, entertaining” – this is the unanimous conclusion of the Rehm Technology Days in Blaubeuren. “Once again, we really thought about how we can offer our customers and partner companies an interesting day,” said Managing Director Johannes Rehm. Visitors were invited to island hopping on the “Technology Islands”, which offered not only exciting insights but also fascinating views into the future.
Redmond, WA, October 15, 2018 – Data I/O Corporation (NASDAQ: DAIO), a leading global provider of advanced data programming and security provisioning solutions for flash-memory, flash-based microcontrollers, secure elements and authentication ICs, will join industry leaders to discuss best practices for designing and securing Arm based microcontrollers into IoT applications at Arm TechCon 2018. Arm TechCon takes place from Tuesday, October 16th – Thursday, October 18th at the San Jose Convention Center in San Jose, CA.
Somerset, NJ – October 15th, 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present on the benefits of Low Temperature Soldering Processes at the ‘Soldering Processes in Theory and Practice’ event hosted by smartTec, Alpha’s Premium Distributor for Germany and Central Europe, from the 23rd- 25th October.
LOS ALAMITOS, CA — October 2018 — Practical Components®, a leading international distributor of mechanical IC samples or “dummy” components, evaluation PCB boards, training kits and SMD production tools and equipment, announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.