Lakeville, Minnesota, January 15, 2019 – ITW EAE, the Electronic Assembly Equipment division of ITW will be showcasing MPM, Camalot, Electrovert and Vitronics Soltec equipment at the IPC APEX Expo, January 29 - 31, 2019 in San Diego, California. The ITW EAE booth (3339) will have Engineers and Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
Challenges in handling highly filled and abrasive materials
When it comes to electrically conductive materials, we are dealing with dispersions. They are generally referred to as electrically conductive adhesives, silicones or inks.
Seoul, South Korea – As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology will show how its true 3D solutions can improve production throughput and yield at the IPC APEX Expo during 29-31 January 2019 in San Diego, California. This year, Koh Young will display an array of new inspection systems with expanded capabilities at Booth 1908 in the San Diego Convention Center.
MENTOR, OH ― January 2019 ― Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that it purchased a Delta 6 robotic conformal coating/dispensing system from PVA. The system was installed at Libra’s Mentor facility last month.
NORTH BILLERICA, Mass., January 15, 2019 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, is pleased to announce that CORE-emt now represents its PYRAMAX™ reflow ovens in Sweden, including all of Scandinavia. CORE-emt has been representing BTU in Denmark and Norway for more than seven years.
Pan Pacific Microelectronics Symposium
February 11-14, 2019
Kauai, Hawaii
Register here: https://www.smta.org/panpac/register_now.cfm
Several keynote speakers will present during the upcoming Pan Pacific Microelectronics Symposium this February. These thought-provoking presentations are sure to inspire you in your future technology decision-making.