SAN JOSE, CA ― December 2018 ― SHENMAO America, Inc. is pleased to announce the appointment of MIDwest TEKnologies as its representative in the Midwest region. The manufacturers’ representative will provide sales and customer support for SHENMAO in MN, ND, SD and IA.

December 4th, 2018 ― Cd. Juarez, Chih., Mexico ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, was pleased to provide training to Aptiv employees on October 22nd, 2018 at Aptiv Rio Bravo I in Ciudad Juarez.

This not-to-be-missed event on January 28, 2019 at IPC APEX EXPO 2019 is designed for executives in the global electronics systems supply chain. The forum features such worldwide notables as Dr. Udo Welzel, Team Leader of Automotive Electronics, Engineering Assembly and Interconnect Technology at Robert Bosch GmbH, who will present "Enabling Connected, Electrified and Automated Mobility: Challenges for Assembly and Interconnect Technology'. Also featured is Alex Stepinski Vice President of GreenSource Fabrication LLC and Managing Director of AWP GmbH, who will discuss the world's first “green” 4.0 PCB fabrication facility with single piece flow in-line automated facility with 100% layer traceability for advanced HDI/IC substrate/FPC production, plus its implications for automotive electronics.  

If a product is improved or obsolete components have to be replaced, these changes will affect every process in electronics manufacturing. From solder paste printing to assembly, inspection, and testing, none of these steps will remain unchanged for long. In-circuit testing (ICT) is often a major challenge for redesigns. While the nail bed tester now delivers unbeatable cycle times, the fixture technology also makes it less flexible. The performance of a test system within a production line therefore depends not only on the cycle time, but also on the time it takes to setup design changes.