Press Releases
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announces that the TR7700QE HAPs AOI has conformed to the evaluation standards set by the required specifications for APC-MFB-Compatible AOI. This marks the second APC-MFB certification for TRI’s AOI Systems, preceded by the TR7700E SIII HAP.
Data I/O showcases best practices to design and manufacture connected devices for a flexible and secure supply chain
CYPRESS, CA ― June 2019 ― Metcal today announced plans to exhibit at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 27, 2019 at the DoubleTree by Hilton Minneapolis - Park Place in Minneapolis, MN. Company representatives will demonstrate its Connection Validation (CV) Soldering System with new hand-pieces, AC-STC Tip Cleaner and HCT2-200-11 Hot Air Pencil.
SAN JOSE, CA ― June 2019 ― Naprotek, Inc., a provider of electronic manufacturing services, today announced that it has purchased the Nordson SELECT Cerno® 103IL selective soldering system.
NORTH BILLERICA, MA, June 2019 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that the new Pyramax Vacuum Reflow Oven has been installed at ACI Technologies’ showroom and demo center.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing