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Press Releases

August 27, 2019 – Duluth, GA – Koh Young America will highlight its industry-leading Full 3D inspection solutions and next-generation closed-loop Koh Young Process Optimizer (KPO) at SMTA International on September 24-25 in Rosemont, Illinois. The company cordially invites show and conference attendees to visit booth 609 and learn how industry-leading 3D measurement systems and closed-loop process solutions from Koh Young America can help improve production throughput and yield.

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Scanfil, a global contract manufacturer and systems supplier, announced today that it has signed a global frame agreement with the Danfoss Group. Danfoss is a world-leading company engineering technologies that empower the world of tomorrow to build a better future. Energy efficient technologies empower smart communities and industries to create healthier and more comfortable climates in our buildings and homes and to supply more food with less waste.

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AUBURN HILLS, MI – August 2019 – Murray Percival Company, the leading supplier to the Midwest's electronics industry, is pleased to announce that they will be available to demo the MIRTEC MV-6 OMNI 3D AOI machine* at booth #305 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, IL.

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Hover-Davis, the global leader in the design and manufacture of electronic component and media delivery solutions, will celebrate its 30 year anniversary at SMTA International Electronics Exhibition on September 23-26 where it will display its latest feeder and material automation solutions.

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Minneapolis, Minnesota — August 26, 2019 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at SEMICON Taiwan at the Taipei Nangang Exhibition Center on September 17 at 12:10pm. The company will also exhibit at the show in booth # L0310.

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Irvine, California -- TopLine Corporation, a producer of components for ruggedized semiconductors, urges  defense contractors to plan for delivery delays of critical military components, specifically Field Programmable Gate Array (FPGA) devices, in the event FPGA makers suddenly cannot provide FPGAs with solder columns.

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