[September 11, 2019 – Guadalajara, Mexico] Test Research, Inc. (TRI) will join SMTA Guadalajara 2019 to showcase its test solutions and inspection solutions for the SMT industry. Visit the TRI/SMT Integration Booth at Expo Guadalajara in booth #613 from October 23 - 24, 2019 to learn more about the latest innovations in 3D SPI, 3D AOI, 3D CT AXI, and multicore ICT.
~ Ideal for sealing, gasketing, and potting operations that use abrasive thermal interface materials (TIM), silicones, epoxies, and greases ~
Capacitors 3D printed on the DragonFly system deliver a high level of accuracy, save space and eliminate the need for assembly
Industry-leading resource provides valuable insight for today’s most challenging electronics assembly processes.
The connection to Manufacturing Execution Systems (MES) plays a central role in electronics manufacturing for efficient production control and as a data basis for recording and evaluating relevant data. Despite many efforts, no MES has been able to establish itself as a standard today, which means that a large number of systems exist. New machines and production or inspection systems must therefore be individually adapted to the MES interface on the software side.