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Press Releases

BANNOCKBURN, Ill., USA, January 17, 2019 — IPC invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts and educational course proposals for IPC E-TEXTILES 2019 to be held on Wednesday, September 11 in Philadelphia, Pa.

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Julian Klaiber has been the new Head of Internal Sales at Rehm Thermal Systems since the middle of last year. Christoph Maier will be responsible for the Germany South/East region in future. As central interfaces they keep an eye on both customer requirements and individual solutions plus trends in the electronics industry.

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Speedprint Technologies will use the APEX Expo to promote its range of screen printer platforms that address solder paste printing and dispensing for boards and substrates from the very small to the very large. With the addition of two large board printers in the past year, Speedprint now offers a comprehensive product portfolio to address any surface mount application.

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(Waterbury, CT USA) – January 17, 2019 – The Assembly division of MacDermid Alpha Electronics Solutions, the world leader in the production of electronic soldering and bonding materials, will be delivering a technical presentation and exhibiting at the Rocky Mountain Expo & Tech Forum taking place at Mile High Stadium in Denver, Colorado on Thursday, February 21, 2019.    

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Corona, CA - Mike Konrad will present “The Forgotten Benefits of Cleaning Circuit Assemblies for Harsh Environments” at the SMTA Pan Pacific Microelectronics Symposium February 11-14 at the Kauai Marriott Resort & Beach Club in Kauai, Hawaii.

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Booth #2125, co-located with Nordson ASYMTEK

Carlsbad, California, USA - 16 January 2019 - Nordson DIMA, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, CA - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.

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