The last decade has seen an explosion in 3D printing, among hobbyists and professional users alike. The ability to prototype – or even, increasingly, industrially produce – almost any component with just a CAD package and a 3D printer has transformed the manufacturing landscape. Although there are drawbacks to the process, including proportionate cost and scalability, recent improvements in 3D printing capabilities meant that pre-Covid-19, commentators predicted a bright future for this technology and the sector had been on a solid upward trajectory for around a decade.
Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, continues to secure awards for its product innovations. This time Koh Young received two Mexico Technology Awards for the KY-P3 Automated Pin Inspection (API) system and our KSMART Process Control Software
EUCLID, Ohio, Oct. 23, 2020 (GLOBE NEWSWIRE) -- Intellitronix Corporation, a wholly-owned subsidiary of the US Lighting Group, Inc. (OTC:USLG) and a leading manufacturer of automotive electronics, announced it has purchased a state-of-the-art SMT Component Placement System from Europlacer (France). The Europlacer iineo+ Pick-and-Place platform is a fully automated, multi-functional robotics system with high-speed feedthrough of printed circuit boards (PCB) and precision electronics component placement capabilities.
TORONTO, CANADA -- Bittele Electronics, a Toronto-based Turn-key PCB Assembly firm specializing in prototype and low-to-mid volume printed circuit board (PCB) manufacturing and assembly, announced today the release of its Online Ordering Service featuring Live Chat and Zoom meeting support. This new, state-of-the-art tool allows customers to complete turnkey PCB assembly orders faster and with up to 25% price discounts.
BROMONT, CANADA, October 2020 — Cogiscan, the leading provider of Track, Trace, Control (TTC) & IIoT solutions for the electronics manufacturing industry, is pleased to announce that it has teamed up with AES for sales and service throughout Vietnam.
Indium Corporation will feature its suite of ultra-low residue flip-chip fluxes for enabling the 5G lifestyle at the 18th China Semiconductor Packaging and Test Seminar (CSPT), November 8-10, TianShui City, China.