Minneapolis, MN - The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is “Advanced Packaging: The Dawn of a New Era.” The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.

August 3, 2021 - Haverhill, MA USA - Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits.  The system can also verify the coating thickness.

Showcasing optimized automated inspection technology with extended measurement height capability for a wide range of applications and process inspections

TT adds focus to sustainability agenda, appoints Emma Darke as Group Sustainability Director