MADISON, AL – January 2022 – The news is full of constantly new, improved products and services that require microelectronics. STI Electronics, Inc. has the ability to be your sole partner, from concept to finished product. STI’s Microelectronics Packaging Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies.
A full range of automated selective soldering systems, component lead tinning machines and solderability test equipment will be on exhibit in Booth #1335.
Isola Group (www.isola-group.com), a leading global manufacturer of copper-clad laminates and dielectric prepregs for printed circuit boards (PCBs), will be on hand at the IPC APEX EXPO 2022 exhibition with examples of its high-performance circuit materials for high speed digital circuits, including Tachyon® 100G and I-Tera® MT40 materials. The exhibition (www.ipcapexexpo.org) is scheduled for January 25-27, 2022, at the San Diego Convention Center (San Diego, CA) and represents one of North America’s largest annual gatherings of electronics manufacturing technology and PCB manufacturers.
Palo Alto, CA – January 10, 2022 – Arch Systems today announced that HARMAN International, a wholly-owned subsidiary of Samsung Electronics, Co., Ltd. focused on connected technologies for automotive, consumer, and enterprise markets, has selected Arch Systems as a solution provider for connection, architecture, and analytics for their electronics manufacturing production with a focus on surface mount technology (SMT) equipment.
RANCHO CUCAMONGA, CA (January 1, 2022) – Advanced Deposition & Coating Technologies, Inc., a leading Parylene coating service provider, announced that the company has been appointed as the new North American exclusive distributor of GALXYL® Dimer Raw Materials effective January 1, 2022.
January 6, 2022 - The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components” presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.