RONKONKOMA, NY ― Surf-Tech Manufacturing Corp., a multi- faceted provider of contract manufacturing services, has implemented two new software solutions from CalcuQuote. The company will use the QuoteCQ and ShopCQ software to expedite quoting and order processing, and provide faster feedback to customers.

Due to its full-service capabilities, including all phases of electronic manufacturing and assembly work, many customers have been with Surf-Tech from the beginning. The new software takes the company’s customer service a step further. Stephen Eggart, President, “As we continue to grow, Calcuquote is going to be invaluable to allow us to handle additional sales inquiries.”

QuoteCQ simplifies and expedites the request-for- quote (RFQ) process, allowing Surf-Tech to be more responsive. The software is designed as a comprehensive solution for Electronic Manufacturing (EMS) and other customers in the electronics supply chain. Surf-Tech uses QuoteCQ to manage customer requests, capture assembly requirements, analyze customer BOM, source materials, estimate labor, define markups, and finally, sending a finished quote – all in one convenient solution.

Additionally, CalcuQuote’s ShopCQ is designed for the ever-changing electronics supply chain. From demand to delivery, ShopCQ reduces Surf-Tech’s cycle time, increases efficiency, and creates the seamless sharing of relevant data, allowing the company’s purchasing department to focus on what matters.

Surf-Tech is IPC, ITAR registered and ISO 9001 certified. Personnel are certified to various applicable standards including IPC-A-610 (Acceptability of Electronic Assemblies) and J-STD- 001 (requirements for Soldered Electrical and Electronic Assemblies). For more information, visit www.surftechmfg.com.

NASHVILLE — December 2022 — Kyzen, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that Sherry Stepp has been recognized as one of the Women of Excellence in Metal Forming and Fabricating by MetalForming Magazine in conjunction with the Women in Manufacturing Association (WiM).

As Kyzen's Global Marketing Manager, Stepp has been with the company for more than 25 years. This honor is well earned and deserved for her contributions. She tirelessly exhibits a professional mannerism to Kyzen’s clients and many other organizations. The ladies of Kyzen have set a historic trend of being recognized for their contributions by the industry.

Joe McChesney, Kyzen’s Global Product Line Manager for Solvents, says “This honor is well earned and deserved for her contributions in our markets. She tirelessly exhibits a professional mannerism to our clients and many other organizations. The many hours she freely gives is very much noted and appreciated.”

The 7th Annual Women of Excellence in Metal Forming and Fabricating Awards are given to women in the industry who represent dedication to their company and the industry, and demonstrate excellence in meeting their workplace responsibilities. The goal of this section is not only to recognize excellence in our industry, but also to help support and inspire those that may be interested in a similar career. MetalForming will recognize all of the honorees in the December 2022 issue and online.

Kyzen connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. For more information about Kyzen, or to ask specific technical cleaning questions, visit www.kyzen.com.

HANOVER, GERMANY — Viscom Inc., the US American subsidiary of Viscom AG, Germany, will showcase a selection of its highly advanced inspection systems for 3D SPI, 3D AOI, 3D AXI, and 3D MXI at IPC APEX EXPO 2023 – taking place January 24–26, 2023 in San Diego, California. Visitors are especially invited to discover exciting innovations from the system-related software area; highlights at the Viscom booth (No. 2501) include live demonstrations of the new digital platform vConnect.

Viscom's large system portfolio is designed for many different requirements of today's electronics manufacturing, including intelligent networking of the inspection gates. Standards for automated cross-manufacturer communication, such as IPC HERMES 9852 or IPC CFX, are used in conjunction with proprietary software applications like system operation with vVision or higher-level vConnect control tools.

“Our team of experts is ready to demonstrate live access to extensive information on well-arranged dashboards, fast SPI, AOI, and AXI programming with improved eCAD imports, and also the effective use of artificial intelligence, which enables even more reliable decisions when verifying inspection results,” states Ed Moll, President of Viscom Inc.

Going far beyond standard PCB sizes and addressing the specific requirements of industries such as telecommunications, electromobility or renewable energies, Viscom covers a wide range of customer needs in the field of inline X-ray inspection. Visitors of the IPC APEX EXPO can get an up-close and personal look at the 3D AXI system iX7059 PCB Inspection XL which can handle PCBs up to 63” (1600 mm) in length. The innovative dynamic acquisition mode of the machine ensures particularly fast back calculation to generate extremely accurate CT slice images and display full 3D volumes at the verification station. Additionally, artificial intelligence is now able to reliably segment voids, which can then be measured in detail.

Another X-ray highlight at the show will be Viscom’s X8011-III manual inspection system with intelligent capabilities for networking with the production line, measuring radiation dose to components, and automatically generating meaningful reports. The versatility of the X8011-III makes many applications possible, from comprehensive quality control for production start-ups to one-hundred-percent inspections in high-mix-low-volume manufacturing, including total support from process optimization to the handling of specific tasks.

The S3088 ultra chrome system will be presented as a 3D SPI and as a 3D AOI variant. Thus, a camera module for solder paste inspection with a comparatively large image field and height measurement range, excellent z-resolution and maximum flexibility in lighting technology will be on display. Extremely powerful high-speed image acquisition will be one of the main topics in the context of optical solder joint inspection.

Among the key software-related topics at Viscom’s booth will be intelligent condition monitoring, centralized IT management and high-performance Big Data processing, all of which are modular components of vConnect. The platform’s broad portfolio of scalable, higher-level applications is designed to provide the optimal environment and infrastructure for enhanced digital connectivity. Extensive data is available via freely configured menus and selected according to the requirements of operators, service personnel or management. Based on smart analyses, e.g., potential machine glitch can be detected at an early stage and maintenance intervals optimized.

BRUSSELS — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the progress on the European Chips Act by the European Council, expressing strong support for the swift start of the negotiations in 2023.

With the European Council’s adoption today of its negotiating mandate, or so-called “general approach,” member states and the Czech Presidency of the Council have reached a critical milestone in supporting Europe’s efforts to advance manufacturing and supply of critical components, while bolstering R&D capacities for development of next-generation semiconductor innovations.

“The future for Europe as a region of semiconductor manufacturing excellence is brimming with possibility,” said Laith Altimime, president of SEMI Europe. “The adoption of the European Council’s general approach marks a critical step in passage of the European Chips Act as landmark initiative for our industry.”

As a next step, the European Parliament’s Committee on Industry, Research and Energy (ITRE) is expected to vote on the European Union Chips Act Report in January 2023. Once approved, the Committee will submit the text to plenary for adoption. The vote in plenary is scheduled to take place in February 2023. The text would constitute the European Parliament’s negotiating position and marks the last step before the start of trialogue negotiations among the European Commission, Parliament, and Council.

“SEMI looks forward to continued collaboration with the European institutions and our member companies to ensure the timely adoption and implementation of the European Chips Act, putting Europe’s semiconductor industry on a competitive footing with other regions,” said Christopher Frieling, director of Advocacy and Public Policy at SEMI Europe.

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.