Press Releases
MUENCHEN, GERMANY – Emitech, a company specializing in applied testing for product qualification in the automotive sector, has inaugurated its new vehicle test center in Montigny-le-Bretonneux, France. The EMC chamber is equipped with a complete EMC test system from Rohde & Schwarz including R&S BBA150, R&S BBA130 and R&S BBL200 broadband amplifiers, R&S ESW44 test receivers, R&S SMB100B RF signal generators and power meters. At the inauguration ceremony in March, Rohde & Schwarz also demonstrated its innovative solution for advanced driver assistance system (ADAS) testing.
Emitech's new test center is dedicated to electromagnetic compatibility tests for vehicles: two and three- wheelers, cars, trucks, tractors, construction machinery, etc. The reinforcement of a heavy load area supporting up to 40 t allows it to accommodate construction machinery as well as high-tonnage and high- volume equipment found in the defense, aeronautics, railways and nuclear power sectors and, by extension, industry. The center also has the largest and most recent Faraday cage built in France, which is used to perform electromagnetic compatibility tests to ensure that the equipment under test does not generate interference and is not itself disturbed by interference representative of the context in which it will be used.
The R&S BBA and R&S BBL amplifiers support the EMC tests at Emitech's test center. They are housed in several system racks and supply high-power RF signals to all transducers used in the conducted and radiated EMC test setups. More specifically, two racks for R&S BBL200 amplifiers and a 3 kW power class R&S BBA150 amplifier are installed below the chamber, which work together to create a high field strength from 9 kHz to 1 GHz. The amplifiers use one stripline antenna and two log-periodic antennas. Additionally, a mobile rack including 600 W/300 W power class R&S BBA130 amplifiers with one horn antenna is used inside the chamber for high field strength tests up to 6 GHz.
The R&S BBA amplifiers cover frequency bands up to 6 GHz. These amplifiers can be used for a variety of applications, including the various standards for EMS measurements. The R&S BBL200 liquid-cooled power amplifiers for high field strengths complement the test setup. These amplifiers are ideal for applications requiring high RF power in a frequency range from 9 kHz to 250 MHz. They are liquid-cooled, solid-state, highly rugged, quiet and efficient. Precise monitoring of all runtime parameters ensures maximum robustness and reliability. The amplifiers are designed for continuous operation and deliver constant power even under mismatch conditions.
This Rohde & Schwarz project for the French automotive market represents another benchmark EMC test solution.
CHANDLER, AZ – Isola Group brings the latest cost-effective, high-performance PCB material solutions for hybrid circuits to this year’s Del Mar Electronics & Manufacturing Show (DMEMS2023). With growing demand for miniaturization in electronic design, Isola’s materials support compact PCBs for RF/microwave (RF/MW), high-speed-digital (HSD), and power circuits with high efficiency and excellent thermal stability. The durable circuit materials share processing compatibility with general-purpose circuit materials such as FR-4 for ease of fabricating multilayer circuit solutions with a combination of circuit material types.
DMEMS2023 is set for the Del Mar Fairgrounds (San Diego, CA) on April 26-27, 2023, and features free admission, parking, and an abundance of educational seminars. Isola’s representatives are ready to share their years of experience and expertise on matching PCB materials to different mechanical and electrical circuit requirements. They will welcome DMEMS2023 visitors to booth #100 to learn more about their high-performance but “manufacturing-friendly” circuit materials, including TerraGreen ® 400G, Tachyon ® 100G, Astra® MT77, I-Tera ® MT40, IS550H, IS580G and IS680/IS680 AG laminates and prepregs. These temperature-stable circuit materials enable the fabrication of HSD circuits and high- frequency RF, MW, and millimeter-wave (mmWave) signals beyond 110 GHz on the same circuit board.
When the highest signal integrity must be maintained, TerraGreen ® 400G, Tachyon ® 100G, I- Tera ® MT40 and I-Speed® circuit materials support HSD circuits at rates up to and beyond 100 Gb/s. Visitors to the booth can learn more about the characteristics of each material and how they benefit some of the latest high-frequency/high-speed circuits for computing, automotive, aerospace and defense, robotics, space, and telecommunications applications. For applications requiring halogen-free materials, stop by the booth and ask about Isola’s latest offerings. IS550H is our halogen-free solution for high power & voltage applications with extreme thermal stability requirements. The TerraGreen® 400G family of laminates and prepregs provide a range of cost and high speed digital performance solutions up to 200Gb/s. IS580G is a halogen-free material with I-Speed-like electrical performance and optimized Z- axis CTE for thermal reliability.
For more information about any of these materials, please visit the Isola website at www.isola-group.com
CLINTON, NY – The next episode of Indium Corporation’s free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to premier on Thursday, May 11, at 11:30 a.m. EST.
EV InSIDER Live is co-hosted by Indium Corporation’s Global Head of e-Mobility and Infrastructure, Brian O’Leary, and Loren McDonald, EV consultant and CEO of EVAdoption. It is conducted in a candid and conversational format suitable for business executives, casual observers, and seasoned engineers alike.
The upcoming session, featuring special guest Oliver Gross, Global Director of Energy Services – Electrification and EV Operations at Stellantis, will explore a range of topics including:
- The role of automakers in the future, including the circular economy. Will automakers follow Tesla's lead and compete in both the electric vehicle and energy spaces? Gross will outline his idea for the Energy Internet of Things (EIoT), vehicle to grid opportunities, and the interplay with microgrids and virtual power plants.
- The latest developments in battery technology and chemistry that could significantly extend the life of EV batteries. Hosts will examine the likely “high/low” bi-furcation of battery chemistries for low-range and long-range EV applications. Which approach will win out in the end: recycling or repurposing batteries in second-life applications? How will bi-directional charging affect battery life? Is the 70%-80% energy capacity rule of thumb for EV end-of-life the right metric, or do we need to think differently about battery lifespans?
- How will government action impact supply chains? What effect will the recent Clean Vehicle Credit (CVC) battery cell requirement have moving forward? Will EV battery production be akin to the New Deal in the U.S.? What about the politics and challenges of producing battery cells, primarily with Asian partners? How will regional regulations impact the powertrain and battery strategies of automakers?
“Season two of EV InSIDER Live got off to a great start in April with a timely examination of EV fast chargers,” said O’Leary. “Loren and I are now looking forward to welcoming a battery expert like Mr. Gross and, together, exploring the exciting challenges and opportunities that lie ahead.”
Click here to register for the upcoming episode or, optionally, register for all upcoming season two episodes. All sessions will be made available for on-demand viewing afterward. EV InSIDER Live is driven by Indium Corporation.
SAN DIEGO, CA – Intraratio, a provider of enterprise software solutions, announced today that it will be exhibiting at the Surface Mount Technology Association (SMTA) Juarez Expo. The event will be held Thursday, May 19, 2023 at the Polanco Complex - Hall A (Convention Center) in Juarez, Mexico. Intraratio will discuss its integrated Manufacturing Execution System & Quality Data Management platform for real-time automated operations traceability and quality control.
With a transaction-based pricing model, Intraratio is able to serve Startups to Global Tier 1. The company delivers an infrastructure capability and advantage previously exclusive only to large organizations.
Backed by more than 30 years of global high-tech engineering and manufacturing experience, the Intraratio platform breaks the accessibility and integration limitations of existing software systems – putting data-driven innovation and improvements at the fingertips of those who are passionate about operational excellence.
Intraratio provides enterprise software solutions to automate traceability and quality control of advanced electronics product manufacturing. The company serves the high-performance computing, automotive, space military, and medical device markets. Deployed globally, Intraratio’s platforms bring true visibility and scale to manufacturing operations anywhere. For more information about Intraratio, visit www.intraratio.com
LYON, FRANCE – Overall memory packaging revenue is estimated to have been US$15.1 billion in 2022, excluding testing. This corresponds to around 10% of overall stand-alone memory revenue, around US$144 billion in 2022. Yole Intelligence, part of Yole Group, forecasts that revenue will reach US$31.8 billion in 2028 with a CAGR22-28 of 13%.
According to Thibault Grossi, Senior Technology and Market Analyst, Semiconductor & Software Division at Yole Intelligence: “In terms of packaging revenue, DRAM will grow with a CAGR22-28 around 13% while NAND will grow faster, with a CAGR22-28 of 17%. Other memory technologies, such as NOR Flash, EEPROM, SRAM, and emerging NVM, are forecasted to grow with a CAGR22-28 of around 3%.”
AP has become a key enabler of technological progress for NAND and DRAM. Among the different AP approaches, hybrid bonding has emerged as the most promising solution to manufacture higher bit density and higher-performance memory devices.
Whether its use is intended to enable higher performance or smaller form factors, advanced packaging is an increasingly important factor in the memory value equation. From representing about 47% of memory packaging revenue in 2022, AP will represent 77% by 2028.
In this context, Yole Intelligence releases its new product: Memory Packaging 2023 report. In this study, the company – part of Yole Group – presents an overview of the semiconductor memory market, provides an understanding of memory packaging technologies and markets, and offers market forecasts for memory packaging. This report also describes the memory packaging business and delineates and analyzes the competitive landscape.
Wire-bond is the dominant packaging approach. It is widely used for mobile memory and storage applications, followed by flip-chip packaging, which continues expanding in the DRAM market.
The adoption of flip-chip packaging with short interconnects is essential to enable high bandwidths per pin. While wire-bond packaging may still meet DDR 5 performance requirements, analysts expect flip-chip packaging to become a must-have for DDR6.
Leadframe remains widely used for NOR Flash and other memory technologies and is the package with the highest volume of unit shipments.
WLCSP is being increasingly adopted for consumer/wearable applications requiring small form factors, such as True Wireless Stereo earbuds. It is found in low-density memory devices such as NOR Flash, EEPROM, and SLC NAND.
STEINACH UND BAAR, SWITZERLAND – Variosystems, an international electronics services provider, strengthens its expertise in the development and industrialization of electronics solutions by acquiring KUBEG, a rapid prototyping and small series electronics solutions company based in Zizers, Switzerland. The integration into the Variosystems Group will enhance the company’s services portfolio, resulting in the launch of the VARIOincubator.
The VARIOincubator targets customers that aim to develop and industrialize their electronics products in an agile and technology-driven environment. A dedicated team of engineers, technology and manufacturing specialists supports customers from the spark of an idea all the way through to series production and life-cycle management of electronics solutions. «As of today, we are able to build a prototype for our customers within a matter of days, so that they can quickly and reliably validate their electronics solutions, and plan and implement the industrialization together with our team, » says Julian Specker, Head of the VARIOincubator.
Recent years have seen a sharp rise in the demand for technology services of product development and life-cycle management activities. With the integration of KUBEG, which specializes in rapid prototyping and small series production for printed circuit board assembly (PCBA) and box build assembly (BBA), Variosystems underlines its ambition to support customers along the entire value chain, from development through industrialization, manufacturing to life-cycle management. Variosystems will maintain the site in Zizers (Graubünden) along with its current portfolio of services, and will continue to develop its expertise in rapid prototyping and small series production. The existing management team and employees will become part of the Variosystems Group. «We are pleased to continue offering our customers a flexible and attractive development and production platform, and that we now have access to Variosystems' international manufacturing network for scaling customer projects,» says Kurt Egger, founder and General Manager of KUBEG.
The acquisition of Solve Engineering in 2020, the current integration of KUBEG and the launch of the VARIOincubator are underlining Variosystems’ strategy to support customers along the entire electronics solutions value chain. With this acquisition, the company positions itself as an innovative solution provider that helps its customers launch their electronics products faster and more reliably and to scale those with the engagement of the Variosystems team internationally. The company intends to expand the VARIOincubator with leading engineering and technology providers in the field of electronics services. This includes third-party engineering companies looking for a strong development partner, as well as suppliers whose products complement Variosystems' offering. «We are positive that the VARIOincubator enhances our customers in the development and industrialization of electronics solutions, supports their nearshoring initiatives and offers them an inspiring environment of talented engineers, technology specialists and network partners for innovative electronics products, » says Stephan Sonderegger, CEO of Variosystems
Press Releases
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- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S