CAMBRIDGE, UK – With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package. Two key metrics, bandwidth and power efficiency, play a pivotal role in determining the success of these advanced semiconductor packaging solutions. In this article, we will focus on the materials requirement for achieving higher bandwidth, one of the essential factors for improved communication between dies.

Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data that can be transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at incredible speeds. Two primary factors are considered to measure bandwidth: IO/mm and Datarate/IO. IO/mm represents the density of I/O connections available on the die edge, while Datarate/IO refers to the data transfer rate of each I/O terminal measured in bps. By multiplying IO/mm by Datarate/IO, we calculate the bandwidth per millimeter of the die edge, which represents the total data that can be transmitted between dies. In simpler terms, bandwidth density indicates the number of bits transmitted and received between dies per mm (for 2D) or per mm2 (for 3D packaging).

The performance of IO/mm and Datarate/IO heavily relies on the redistribution layer (RDL) within the package. Essential features of the RDL, such as Line/Space (L/S), via, and pad dimensions, play a crucial role in achieving optimal performance and data transmission within the package. The dielectric constant of materials used in the redistribution layer (RDL) directly impacts the datarate/IO. Currently, the finest L/S of RDL can be attained using inorganic dielectrics like SiO2, but the material's relatively high dielectric constant (Dk=3.9) makes it unsuitable for high-speed communication. Additionally, the process is also challenging and costly. As a result, researchers are actively exploring alternative dielectric materials, particularly organic options, which offer the advantages of lower dielectric constants and reduced costs. When selecting organic dielectric materials, several key parameters must be considered to ensure their suitability for the packaging process. IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report identifies five key parameters crucial for organic dielectrics used in advanced semiconductor packaging.

Dk (Dielectric Constant) and Df (Loss Tangent):
A material's dielectric constant (Dk) determines its ability to support higher data rates without compromising signal integrity. Materials with low Dk are preferred for advanced semiconductor packaging as they reduce wire capacitance and allow for shorter interconnects between dies. Low-loss characteristics also minimize transmission loss in high-frequency communication devices, further enhancing bandwidth.

Elongation to Failure:
For multi-layer RDL (Redistribution Layer) with a higher copper coverage on each layer, a higher elongation to failure is favorable. This property ensures the material can withstand the stresses and strains associated with the packaging process and device operation without mechanical failure.

CTE (Coefficient of Thermal Expansion):
To ensure package reliability, the dielectric material should have a CTE similar to that of the copper metal layer. However, achieving this is challenging due to the inability to use filler particles that increase the dielectric permittivity of the polymer. SiO2 fillers, commonly used in polymer dielectrics, do not aid in reducing the Dk value as they need to be loaded in high volume. Additionally, the presence of fillers hinders the scaling of microvias, which are essential for advanced packaging technologies.

Young's Modulus:
For a reliable microvia design with a diameter of less than 5 µm, utilizing a polymer material with a low Young's modulus is crucial. A low modulus helps minimize the stress exerted on the copper, leading to enhanced overall package reliability.

Moisture Absorption:
Moisture absorption of the polymer material is crucial for long-term system reliability. High moisture absorption can lead to delamination and negatively impact both mechanical and electrical performance.

In conclusion, as technology continues to advance, the demand for even higher bandwidth and power efficiency in advanced semiconductor packaging will persist. Organic dielectrics have garnered significant interest due to their potential in offering low dielectric constant (Dk) characteristics, enhanced defect tolerance, and cost-effectiveness. However, it is crucial to acknowledge that selecting the appropriate material always involves trade-offs. For instance, while low dielectric constant polymers offer advantages, they may come with a higher coefficient of thermal expansion (CTE), which can adversely affect device reliability and packaging architectures. Therefore, it becomes imperative to carefully consider and adhere to the five key features and their requirements to ensure the successful development of advanced semiconductor packaging solutions.

IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report offers a structured approach to understanding advanced semiconductor packaging. The report is divided into four main parts. The first part provides a comprehensive introduction to technologies, development trends, key applications, and the ecosystem of advanced semiconductor packaging. The second part focuses on 2.5D packaging processes, including dielectric materials, RDL fabrication techniques, and material selection for EMC and MUF. The third part delves into the innovative Cu-Cu hybrid bonding technology for 3D die stacking, offering insights into the manufacturing process and material selection. The report also includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, providing valuable perspectives on market growth and trends for the coming decade.

To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP

SINGAPORE – Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company") announced its collaboration with TSMT (Taiwan Surface Mounting Technology Corp), a worldwide leading LCD SMT (Surface Mount Technology) solutions provider, to advance mini LED backlight and direct emissive displays for high-volume adoption.

Mini LED technology in displays is anticipated to increase rapidly over the coming years, providing new opportunities for Kulicke & Soffa's advanced display portfolio. TrendForce, a world leading market intelligence provider, anticipates mini LED wafer shipments will increase at a CAGR of 38%, to over 8M four-inch equivalent wafers, through 2027. During this period, LED die size is expected to be reduced significantly in both backlighting and direct emissive applications, accelerating the transition from more typical semiconductor die-attach approaches, to dedicated advanced display approaches. The Company's dedicated advanced display solutions – PIXALUX™ and LUMINEX™ – support demanding market requirements with new-levels of throughput and high-accuracy placement capabilities. Leveraging these innovative dedicated solutions as well as the collective process knowledge of both K&S and TSMT, this collaboration seeks to overcome today's process challenges to accelerate the mass adoption of advanced display technology.

PIXALUX™ quickly became the largest installed base of ultra-fast dedicated mini LED placement equipment shortly after its 2018 introduction. Today, LUMINEX™ extends K&S leadership by providing a dedicated laser-based mini and micro LED transfer solution that enhances flexibility, yield and productivity for panel and display manufacturers. LUMINEX is designed to transfer small die with high accuracy and throughput.

"We are excited to enhance our long-term relationship with K&S to deliver high-volume manufacturing solutions for mini LED backlighting and direct emissive displays. Through joint efforts, LUMINEX™ has achieved an impressive production throughput of 540K units per hour (UPH) at 15µm 3-sigma accuracy, broadening the market reach for this technology. We are currently working on improving the yield from 99.99% to 99.999%," said John Wu, TSMT's President.

"Our comprehensive advanced display portfolio directly serves the technology needs of major display markets rapidly transitioning to advanced display technology. Key markets transitioning include high-volume televisions, IT displays, as well as both large and small format direct-emissive displays. Today, LUMINEX™ is the most compelling high-volume manufacturing solution for mini-LED transfer and we are extending its capability to micro LED," said Chan Pin Chong, Kulicke and Soffa's Executive Vice President, Products and Solutions.

The throughput of LUMINEX™ is scalable through its various modes of operations – Precision Correction Mode (PCM), Multi-pattern Placement (MPP) and SCAN Mode. In the scan mode, it is capable of throughput of over 30M UPH. While LUMINEX™ is preparing to move into high-volume adoption for mini-LED applications, initial micro LED development results are encouraging and the Company has achieved 4µm 3-sigma accuracy for direct die placement of 40µm x 80µm die. This solution is also suitable for Micro LED in Package (MIP) applications.

TEMPE, AZ – Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power, analog and discrete devices, and electronic assemblies and modules focusing on enabling technologies for electric vehicles (EV) and clean technology (CleanTech) applications, today announced that Michael Whang stepped down as Chief Executive Officer, effective August 8, 2023. The board has appointed Bob Daigle, current Chairman of the Board, with the additional role of Chief Executive Officer, effective August 8, 2023. To support the transition, Mr. Whang will remain as an advisor until February 8, 2024.

“I’d like to thank Michael for his service to Amtech over the past 19 years and for the last three years as Chief Executive Officer. Michael led during the challenging COVID period and positioned the Company well for the future. Amtech has tremendous growth opportunities driven by demand for Silicon Carbide (SiC) semiconductors required for the emerging electrical vehicle industry, the acceleration of advanced packaging to support the emerging artificial intelligence server market, and investments that will be made to build a more resilient global supply chain in the broader electronics industry. Our mission is to fully capitalize on these growth opportunities and deliver the profitability essential to creating shareholder value,” stated Bob Daigle, Chairman of the Board and CEO of Amtech Systems.

Mr. Daigle has served on the Amtech Board since August of 2021 and as Chairman of the Board since March of 2022. He served in various senior executive roles during his 30+ year tenure at Rogers Corporation. While at Rogers, Mr. Daigle built and led the High Frequency Circuit Materials business and the Power Electronics Solutions business. Mr. Daigle holds a B.S in Chemical Engineering and Materials Engineering from the University of Connecticut and an M.B.A. from Rensselaer Polytechnic Institute.

BILLINGSTAD, NORWAY – Northrop Grumman Corporation (NYSE: NOC) has awarded Kitron a sub-contract for production of AN/ASQ-242 Integrated Communications, Navigation, and Identification (CNI) modules for the F-35 Lightning II-program. Deliveries will secure a backlog into 2025 and have a total value of more than USD 13 million.

Production will take place at Kitron’s plant in Norway.

The sub-contract relates to the Long-Term Supply Agreement announced on 21 September 2015 and 24 November 2016, and covers Lot 16 through Lot 17.

Northrop Grumman’s ICNI-system provides F-35-pilots with more than 27 fully integrated operational functions. Using its industry leading software-defined radio technology, Northrop Grumman’s design allows the simultaneous operation of multiple critical functions while greatly reducing size, weight, and power demands on the advanced F-35 fighter. These functions include Identification Friend or Foe (IFF), automatic acquisition of fly-to-points, and various voice and data communications such as the multifunction advanced data link.

Norway is one of the international partner countries participating in the F-35 program. Under a manufacturing license agreement between Kitron and Northrop Grumman, Kitron will manufacture sub-assemblies for the F-35 Joint Strike Fighter.