PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce its participation in NEPCON Asia 2023 after six years, at Booth #5D40 in Shenzhen World Exhibition & Convention Center (深圳国际会展中心 - 宝安新馆）from 11th to 13th October 2023.

NEPCON Asia provides the perfect platform for ViTrox to unveil its latest advancements in inspection solutions in the Southern region of China, ranging from V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE.

The V310i 3D SPI is the key to ensuring SMT product quality, providing effortless programming while achieving effortless programming and accurate inspection results. Equipped with Ultra Smart Programming, users can instantly start inspection without manual parameter setup, making it user-friendly even for inexperienced operators. The V310i 3D SPI also enables precise solder bump and extended height measurements using shadow-free fringe pattern technology, enhancing the maximum 3D rendering capabilities from 450µm to 1500µm. Another great piece of news to share with you is that our SPIs have successfully qualified for the IPC- CFX-2591 Qualified Products Listing (QPL). Read more about our V310i 3D SPI Solution.

Next in our line-up will be the V510i 3D AOI solution, which is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. With A.I. Smart Programming, our AOI can reduce human dependency, rapidly improve the programming speed, and guarantee quality, accuracy, and consistency during inspections. Therefore, users will enjoy up to 80% programming time reduction, ultimately achieving a higher yield. Another significant A.I. technology is the A.I. Assisted Defect Review (A.I. VVTS), designed to automate buy-off processes in repair stations and guarantee over 90% judgement accuracy. Besides, A.I. VVTS can achieve ~ 60% labour reduction, which furthermore reduces 70% of human error and cost. Our V510i 3D AOI has also successfully qualified for the IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification. Read more about our V510i 3D AOI Solution.

The third solution will be our V810i S3 AXI Solution, innovated with an ergonomic design that saves production floor space, while boosting inspection speed by up to 30% with new machine geometry and scanning methods. ViTrox offers a new unique imaging and reconstruction method (H-reconstruction) to address challenging inspections of very heavily shaded components and non-uniformly shaded components, ensuring sharper X-ray imaging for complex components. Equipped with A.I. integration, our AXI solutions offer effortless programming with highly accurate inspection capabilities for challenging joint inspection, such as IGBT and HiP. Plus our 3D AXI Solution has also achieved IPC-CFX-2591 QPL validation. Explore the groundbreaking V810i S3 AXI Solution today.

We will also be showcasing our award-winning V9i ARV Solution, revolutionising flexible inspections for conformal coating and final assembly inspections. Featuring a unique 6-axis COBOT design, it enables adjustable angle inspections up to 90°, guaranteeing convenience. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects. Moreover, our V9i ARV is also capable of performing thorough inspections for screw, cosmetic, connector, and label defects in final assembly, all achieved seamlessly without requiring CAD information. Our V9i ARV solution is built with multi-focal vision, allowing inspection ranging from 5mm to 200mm, thus resulting in high-resolution images as clear as 14µm/px for small defect inspection. The V9i ARV solution ensures complete inspection coverage and always delivers reliable and consistent results. Users can connect the V9i ARV solution to their production in inline mode using SMEMA connections, enhancing traceability in the back-end assembly process compared to manual inspection. Alternatively, they can place the system for offline mode discussion with the existing conveyor. Read more about our V9i ARV Solution’s capabilities in conformal coating inspection and final inspection.

Last but not least, the unveiling of our cutting-edge Industry 4.0 Manufacturing Intelligence Solutions - V-ONE, a Smart Manufacturing necessity that ensures connectivity within the production line, accurate visualisation of data analytics and adept reactivity in Machine-2- Machine (M2M) production. Among the powerful features housed in our V-ONE will be the A.I. VVTS, ONE View, and our Intelligent Control Tower. The A.I. VVTS tool seamlessly integrates with ViTrox's AOI and AXI systems, achieving over 90% A.I. coverage and high accuracy in defect detection, reducing the need for manual labour in inspections. ONE View connects data from various inspection equipment, enabling real-time cross-referencing for enhanced production process oversight and quality assurance. The Intelligent Control Tower facilitates real-time data analysis across multiple production lines, offering customised production impact assessments to fine-tune critical production issues, ensuring optimised performance. With V- ONE, anyone can monitor the production status anytime, anywhere. Read more about the unique features available in our V-ONE: A.I. VVTS, ONE View, and Intelligent Control Tower.

Take advantage of this grand opportunity to meet and network with us at NEPCON Asia 2023! ViTrox’s on-site experts will ensure that all your questions are answered and that you will have a fantastic visitation experience at our booth. Please fill up your preferred appointment schedule via the registration link to meet up with our field experts in person!

For more information, contact us via enquiry@vitrox.com. We hope to see you soon!

REDDITCH, UK – Altus Group, a leading supplier of capital equipment and services to the electronics manufacturing industry, has signed an agreement with SMT Thermal Discoveries to distribute its advanced reflow soldering and thermal technology solutions in Ireland.

With over 30 years of expertise in thermal engineering for electronics manufacturing, SMT Thermal Discoveries offers cutting-edge convection reflow, curing, and thermal testing equipment. Their innovative product portfolio will significantly expand and strengthen Altus’ solutions for Irish customers across various electronics sectors.

Altus has recently celebrated significant milestones and growth of its Irish division, including welcoming three new pivotal team members, inaugurating a state-of-the-art demonstration facility, and enhancing its portfolio by adding leading brands, including Essemtec and PVA. The partnership with SMT Thermal Discoveries demonstrates Altus’ continued commitment to expanding its offerings and service capabilities for customers in the region.

"We are pleased to partner with such a well-respected and established industry leader like SMT Thermal Discoveries," said Gareth Fenton, Sales Manager of Altus Group Ireland.

"It seems as though good news is coming thick and fast for the Irish team, and partnering with SMT Thermal Discoveries is a great new addition to the Irish team brand portfolio, complementing our turnkey offering across the SMT assembly process."

Daniel Hamann, European Sales Manager at SMT Thermal Discoveries, said: "Altus Group's technical expertise, customer focus, and passion for growth make them an ideal partner. We are delighted to agree on a new partnership with Altus to be our local partner in the Irish region.

"We are confident this partnership will be very successful and look forward to leveraging our combined strengths to bring innovations, solutions, and service capabilities to Altus’ customers in Ireland."

"SMT Thermal Discoveries offers an extensive range of solutions tailored to the specific needs of our customers in Ireland,” said Gareth. “With a strong local customer base already in place, the groundwork has been laid, and I am enthusiastic about the possibilities that lie ahead. With Daniel and the SMT technical team's support, we aim to further enhance our success by providing our customers with comprehensive turnkey SMT assembly capabilities."

This partnership is set to provide Irish electronics manufacturers with advanced yet accessible production solutions to help streamline processes, improve quality control, enhance efficiency, and increase productivity. By distributing SMT Thermal Discoveries' innovative portfolio Altus is providing their customers with state-of-the-art, automated tools to optimise manufacturing output while controlling costs effectively.

To find out more about Altus Group’s advanced equipment visit www.altusgroup.co.uk

CLINTON, NY – Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

As an industry leader in heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature its proven SiPaste® series, specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. The newly released, award-winning SiPaste® C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.

Indium Corporation will also feature NC-809, the first low-residue, no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with superior wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.

NC-809 is designed to leave minimal residue after reflow at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes, such as NC-26S and NC-699. NC-809 is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps that can increase substrate warpage, both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

Indium12.8HF is an award-winning, no-clean, halogen-free solder paste formulated to be compatible with a wide range of microdispensing and jetting systems. It provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

Also on display will be QuickSinter®, a high metal content paste, redefining sinter technology. Available in pressure and pressureless formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.

In addition to a diverse assembly of advanced packaging products, Indium Corporation will feature proven thermal management products at the show, as well. The company’s new line of innovative liquid metal pastes (LMP) has enabled a true liquid metal-based TIM solution capable of handling heat dissipation issues while maintaining long-term reliability. With higher viscosity than standard liquid metal, Indium Corporation’s next generation LMPs offer:

• Rth as low as 0.03kW
• Predictable spreading characteristics
• Lower risk of pump-out
• Lower total costs

Heat-Spring® solutions, ideal for TIM2 applications, are a compressible interface between a heat source and a heat-sink. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK. They are available as pure indium, pure indium clad with aluminum to prevent sticking to the device under test (DUT), indium-silver alloys, and indium-tin alloys.

The GalliTHERM™ portfolio of gallium-based liquid metal solutions draws on the company's more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:

• High thermal conductivity for end-product longevity and reliability
• Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
• Extraordinary wetting ability to both metallic and non-metallic surfaces

To learn more about Indium Corporation’s thermal management and advanced packaging solutions, visit our experts at booth #229. If unable to attend the show, visit us online at www.indium.com/TIM or www.indium.com/HIA for more information.

PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce the addition of Hayden Dalton to our team as a Field Support Engineer who based in Milwaukee, WI, effective August 21, 2023.

Hayden holds a Bachelor of Science Degree in Computer Engineering from the renowned Milwaukee School of Engineering. He is now embarking on his career journey with ViTrox, and his valuable perspective and enthusiasm for the industry are invigorating.

Hayden's primary focus will be on providing dedicated support for our V810i Advanced 3D X-ray Inspection (AXI) solution. In this role, he will play a pivotal part in enhancing ViTrox's commitment to delivering top-tier technical support and service to our valued customers across the USA.

"We are excited to welcome Hayden to our team. His educational achievements and fresh energy will make him an invaluable resource to our team as we continue to innovate and deliver cutting-edge technology solutions to our customers," said Richard Osborne, Sr. General Manager of ViTrox Americas Inc.

Hayden is equipped with the necessary skills and knowledge to ensure our customers' satisfaction. ViTrox is confident that Hayden's dedication and expertise will undoubtedly contribute to our ongoing success and unwavering commitment to exceeding customer expectations.