PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce the addition of Hayden Dalton to our team as a Field Support Engineer who based in Milwaukee, WI, effective August 21, 2023.

Hayden holds a Bachelor of Science Degree in Computer Engineering from the renowned Milwaukee School of Engineering. He is now embarking on his career journey with ViTrox, and his valuable perspective and enthusiasm for the industry are invigorating.

Hayden's primary focus will be on providing dedicated support for our V810i Advanced 3D X-ray Inspection (AXI) solution. In this role, he will play a pivotal part in enhancing ViTrox's commitment to delivering top-tier technical support and service to our valued customers across the USA.

"We are excited to welcome Hayden to our team. His educational achievements and fresh energy will make him an invaluable resource to our team as we continue to innovate and deliver cutting-edge technology solutions to our customers," said Richard Osborne, Sr. General Manager of ViTrox Americas Inc.

Hayden is equipped with the necessary skills and knowledge to ensure our customers' satisfaction. ViTrox is confident that Hayden's dedication and expertise will undoubtedly contribute to our ongoing success and unwavering commitment to exceeding customer expectations.

Oldham, UK – Solderstar, a leading supplier of temperature profiling equipment for reflow, wave, vapor, and selective soldering, is set to make significant strides in the industry at Productronica 2023 from 14-17 November. Located at Booth A4.246/4, the company will demonstrate its latest technological advancements and provide the first-ever reveal of a revolutionary new soldering process control technology poised to transform the measurements of advanced soldering applications.

At the forefront of Solderstar's showcase is the Reflow Shuttle, an innovative solution designed to transform reflow process verification. The Reflow Shuttle represents a significant leap forward in the electronics industry, offering precise measurement of critical reflow parameters and bringing unprecedented accuracy and insight into the soldering process.

The Reflow Shuttle boasts a comprehensive set of features to address the complexities of modern reflow environments. It utilises an array of independent sensors to measure top and bottom temperature profiles, providing a comprehensive view of the reflow oven's performance. This detailed data allows engineers to fine-tune and optimise soldering processes with unparalleled precision.

In addition to temperature profile verification, the Reflow Shuttle assesses zone heater uniformity, ensuring that heat is evenly distributed across the soldering environment, reducing the risk of defects and improving product quality. Understanding the impact of vibration is crucial in soldering processes, and the Reflow Shuttle captures process vibration in X, Y, and Z axes, allowing engineers to analyse and mitigate the effects of machine vibrations on product quality.

Furthermore, the Reflow Shuttle provides insights into conveyor performance by measuring line speed, helping manufacturers maintain consistent production rates and product quality. For processes that involve vacuum stages, the Reflow Shuttle offers an optional measurement module to verify vacuum levels down to 10 mbar. It automatically calculates hold time below the desired vacuum level and monitors pull-down and release rates, ensuring precise control over the soldering environment.

Mark Stansfield, CEO at Solderstar, said: "In today's intricate reflow environments, conventional temperature-based measurements are inadequate. The Reflow Shuttle provides an all-encompassing solution, offering temperature data and vital insights into heater uniformity, vibration, line speed, and vacuum levels. This gives engineers comprehensive insights into their soldering processes, enhancing product quality and efficiency.

“We are looking forward to welcoming visitors to our stand at Productronica, where we will showcase our latest cutting-edge technologies and introduce an exciting new product that promises to make a significant impact.”

The Reflow Shuttle is engineered for ease of use, enabling machine operators to collect data independently and reducing dependence on specialised engineering personnel. Seamless integration with Solderstar's Shuttle Central software streamlines data collection and analysis, optimising efficiency.

Also taking centre stage on the stand is Solderstar's zero set-up SLX thermal profiler. SLX is an accurate, robust, ultra-compact, battery-powered datalogger used for measuring and recording process parameters from any soldering process. The SLX unit can be docked onto any SMARTLink reflow heatshield or other process accessory, and the system will auto-configure itself for data capture.

Visitors to Productronica, taking place from 14-17 November, Munich, Germany, are invited to explore these ground-breaking solutions at Solderstar's Stand A4.246/4. Solderstar's team of experts will be on hand to provide detailed insights, live demonstrations, and answers to technical enquiries.

BLAUBEUREN, GERMANY – For several years now, Motek/Bondexpo in Stuttgart has been a consistent part of Rehm Thermal Systems' trade fair calendar. The focused orientation of the trade fair on the process chain of joining/connecting through adhesive bonding, potting, sealing, and foaming makes it an ideal platform for Rehm, especially in the areas of Conformal Coating and Dispensing. At Bondexpo, in Hall 5, Booth 5505, a ProtectoXP with an integrated 3D height sensor will be showcased, enabling reliable dispensing on various shapes.

Motek/Bondexpo provides designers, investment decision-makers, and purchasers with a clear profile, strong themes, and practical solutions, giving them everything they need to enhance and make their manufacturing processes more cost-effective. In a pleasant atmosphere, suppliers and users come together to discuss practical and actionable solutions. On-site Rehm experts are available to answer all questions related to dispensing various materials for joining processes, as well as potting and securing components. At Hall 5, Booth 5505, you can witness live demonstrations on a ProtectoXP, showcasing the diverse application areas and the new integrated 3D height sensor of this coating and dispensing system.

The Protecto systems deliver secure, automated processes and precise outcomes for applying a wide range of materials. They excel with robust engineering and versatile applications in the fields of dispensing and adhesive technology. With up to 4 applicators usable simultaneously, users have various options: In addition to dispensing, the ProtectoX series stands out for its ability to create freely defined three-dimensional enclosure shapes through simple application. Instant curing of UV coatings is possible with ProtectoX systems, as well as potting or bonding different materials.

The systems are operated through the intuitively controlled ViCON Protecto, which is particularly user-friendly due to its newly developed touchscreen interface. It features numerous software capabilities, including the ability to directly import eCAD data and image files for optimizing the coating process through trimming. Furthermore, coating programs can be created directly on the machine or at an offline workstation.

Gianfranco Sinistra, Product Sales at Rehm Thermal Systems, will also provide information on "Smart Solutions for Dispensing Applications" in his presentation on Wednesday, October 11, at 09:40 AM in the Motek Exhibitor Forum, Hall 5, Booth 5435. He will discuss the possibilities of designing complete dispensing lines as well as their horizontal and vertical integration for automated application control.

BALTIMORE, MD – Zentech Manufacturing is pleased to announce that it has chosen Tim Facklam to be its Chief Operating Officer. Tim will be responsible for leading Zentech in a collaborative environment to continuously improve operational performance in predictability, quality, cost, and customer satisfaction, as well as supply chain and operational excellence functions. He will also serve as a key member of the Zentech Senior Leadership Team.

Tim brings over 30 years of experience in the electronics industry and has served in a variety of roles during his career - (supply chain, engineering and technology services program management, operations management). Most recently, Tim was the Group VP of Operations at Benchmark, where he managed four sites across the US. Tim is experienced in the high reliability electronics space and is committed to Zentech’s goal of Mission Critical Manufacturing.

Prior to joining Benchmark in 2011, Mr. Facklam served for 6 years as Bluegene Supercomputer Delivery and Operations Manager at IBM. Preceding IBM, Mr. Facklam was Director of SCM at Celestica, an EMS provider.

Mr. Facklam holds a BBA in Business Management and Computer Science from the University of Wisconsin – Eau Claire and holds APICS and Black Belt certifications

Mike Buseman, Zentech’s Chief Executive Officer, said: “We are thrilled to have someone of Tim’s caliber joining our team at Zentech. His experience and leadership in contract manufacturing, OEMs, and supply chain will have a positive impact on both our company and our customers. These are extraordinary times for US manufacturing, we will continue to partner with our customers as the trusted source to deliver their mission critical manufacturing solutions.”

Tim commented, "I am honored to lead Operations at Zentech and look forward to working with an outstanding leadership team and the talented and dedicated staff at each site. I am thrilled to be a part of an organization that is focused on growing manufacturing capabilities and capacity in the US, and look forward to driving solutions for our customers’ complex challenges."