News
WASHINGTON – NextFlex, the Department of Defense (DoD) sponsored Manufacturing Innovation Institute focused on maturing hybrid electronics, has released Project Call 9.0 (PC 9.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing.
ATLANTA – The electronic components sales sentiment fell to 112.3 in May, down nearly 12 points from April but still marking the fourth month of positive overall sentiment, ECIA found in its latest Electronic Component Sales Trend survey.
BRUSSELS – Despite the adoption of the European Chips Act, the EU’s market share in critical electronics components beyond chips, including PCBs, EMS and advanced packaging, will decline to 15% by 2035, according to a new IPC report.
Press Releases
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- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
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